Taolo e Nepahetseng ea Mocheso bakeng sa Litsamaiso tsa Laser le Lisebelisoa tsa Indasteri Ho tloha ka 2002
Puo
Ka lebaka leo, Mong. Pak, eo e leng molaoli oa ho reka oa k'hamphani ea theknoloji ea Korea, o rekile metjhini e mengata ea "femtosecond laser wafer dicing" e nang le "industrial chiller system" ea CWUP-20.
Wafer ke thepa ea mantlha ea chip eo e leng karolo ea mantlha ea mefuta e mengata ea lisebelisoa tsa elektroniki, 'me mokhoa oa ho qoelisa o qhekella haholo molemong oa nts'etsopele ea wafer, hobane o hloka ho nepahala ho holimo libakeng tse nyane haholo. Ka lebaka leo, Monghali Pak, eo e leng mookameli oa ho reka oa k'hamphani ea thekenoloji ea Korea, o ile a reka mechine e mengata ea femtosecond laser wafer dicing e nang le "industrial chiller system" ea CWUP-20.
Bakeng sa lintlha tse qaqileng tsa S&A Teyu indasteri chiller tsamaiso CWUP-20, tobetsahttps://www.teyuchiller.com/portable-water-chiller-cwup-20-for-ultrafast-laser-and-uv-laser_ul5
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TEYU S&A Chiller e thehiloe ka 2002 ka boiphihlelo ba lilemo tse 21 tsa tlhahiso ea chiller, 'me hona joale e amoheloa e le pula-maliboho oa theknoloji ea pholiso le molekane ea tšepahalang indastering ea laser.
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