I-Chip ingumkhiqizo wezobuchwepheshe owumongo enkathini yolwazi. Yazalwa ngohlamvu lwesihlabathi. Impahla ye-semiconductor esetshenziswe ku-chip yi-silicon ye-monocrystalline kanti ingxenye eyinhloko yesihlabathi i-silicon dioxide. Ukudlula ekuncibilikeni kwe-silicon, ukuhlanzwa, ukubunjwa kwezinga lokushisa eliphezulu kanye nokwelula okujikelezayo, isihlabathi siba induku ye-silicon ye-monocrystalline, futhi ngemva kokusika, ukugaya, ukusika, ukucwenga nokupholishwa, i-silicon wafer ekugcineni yenziwa. I-Silicon wafer iyinto eyisisekelo yokwenziwa kwe-semiconductor chip. Ukuze kuhlangatshezwane nezidingo zokulawulwa kwekhwalithi kanye nokuthuthukiswa kwenqubo nokwenza lula ukuphathwa nokulandelela ama-wafers ekuhlolweni okulandelayo kokukhiqiza nezinqubo zokupakisha, amamaki athile afana nezinhlamvu ezicacile noma amakhodi e-QR angaqoshwa ebusweni bewafa noma izinhlayiya zekristalu. Ukumaka nge-laser kusebenzisa uhlaka olunamandla amakhulu ukuze lukhanyise iwafa ngendlela engathinteki. Ngenkathi kwenziwa umyalo wokuqoshwa ngokushesha, imishini ye-laser nayo idinga ukupholiswa ngayo S&A I-UV laser chiller ukuze uqinisekise ukuphuma kokukhanya okuzinzile kanye nokwanelisa imfuneko yokumaka enembayo ephezulu yendawo eyisicwecwana.Ukusuka ohlamvu lwesihlabathi kuya ku-silicon wafer bese kuba yi-chip ephelele, kunesidingo esiqinile sokunemba kwenqubo yokukhiqiza. Ukunemba kokumaka kwe-laser kuxhumene nakanjani nesixazululo esinembile sokulawula izinga lokushisa. S&A i-chiller ibonakala incane enqubweni eyinkimbinkimbi futhi eyisicefe yokukhiqiza i-chip, kodwa isiqinisekiso esinembayo esibalulekile sesixhumanisi esimaphakathi, sinesiqinisekiso sokunemba okuningiliziwe ukuthi i-chip iya ensimini eyinkimbinkimbi.
Ukulawula Ukushisa Okunembile Kwezinhlelo Ze-Laser Nezicelo Zezimboni Kusukela ngo-2002
Ulimi
