S&Hāʻawi ʻia kahi ʻenehana ʻenehana me nā makana Ringier Technology Innovation Awards e pili ana i ka ʻenehana Laser 2018
Ma ka lā 18 o ʻOkakopa, 2018, S&Ua kono ʻia ʻo Teyu e hele i ka Ringier Technology Innovation Awards 2018 Ceremony i mālama ʻia ma Shanghai. He hanana nui e pili ana i ka laser kahi e hui pū ai nā hui i hāʻawi ʻia, nā loea laser a me nā poʻo o ka Laser Association
Aia ma lalo iho ka ʻōlelo a ka Pelekikena o Ringier Industrial Sourcing:
Welina mai e hele i ka Ringier Technology Innovation Awards 2018 – ʻOihana Laser. I nā makahiki he 20 i hala iho nei, ua ʻike ʻo Kina i ka ulu wikiwiki o ka ʻoihana laser. Ua lilo ʻo Kina i kumu hana nui o nā lako hana laser. 20 mau makahiki i hala aku nei, ua paʻakikī ke noʻonoʻo i ka weld i ka plastic a me ka metala e ka laser a ʻaʻole mākou i manaʻo e hoʻololi ka laser i nā mea hana ʻoki metala cnc a lilo i kumu hana nui i ka ʻoki ʻana, ka mālama ʻana i ka ʻili, ka mākaʻikaʻi ʻana, ke kahakaha ʻana a me ka welding. I kēia mau lā, ua hoʻohana nui ʻia ka laser i ka hoʻoponopono pololei, PCB, micro-processing, wahi lapaʻau, mālama niho a me nā mea hoʻonaninani ʻē aʻe.
Aia ma lalo ke kiʻi o 14 i hāʻawi ʻia i nā ʻoihana hana ʻenehana laser
Aia ma lalo iho ke kiʻi o nā mea hoʻolako lako laser i hāʻawi ʻia (ʻekolu mai ka ʻākau ʻo Manager Huang, ka ʻelele o S.&ʻO kahi chiller ʻoihana Teyu)
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