I-Chip yeyona mveliso ingundoqo yetekhnoloji kwixesha lolwazi. Yazalwa ngokhozo lwesanti. Izinto ze-semiconductor ezisetyenziswe kwi-chip yi-silicon ye-monocrystalline kwaye inxalenye engundoqo yesanti yi-silicon dioxide. Ukuhamba ngokunyibilikiswa kwe-silicon, ukucocwa, ukumila kobushushu obuphezulu kunye nokwelula okujikelezayo, isanti iba yintonga ye-silicon ye-monocrystalline, kwaye emva kokusika, ukucola, ukusika, ukupholisa kunye nokupolisha, i-silicon wafer yenziwa ekugqibeleni. I-Silicon wafer sisixhobo esisisiseko sokwenziwa kwetshiphu ye-semiconductor. Ukuhlangabezana neemfuno zolawulo lomgangatho kunye nokuphuculwa kwenkqubo kunye nokuququzelela ukulawulwa kunye nokulandelwa kwee-wafers ekuvavanyeni okulandelayo kokuvelisa kunye neenkqubo zokupakisha, amanqaku athile afana neempawu ezicacileyo okanye iikhowudi ze-QR zinokukrolwa kumphezulu we-wafer okanye i-crystal particle. Ukumakishwa kweLaser kusebenzisa umqadi onamandla amakhulu ukukhupha iwafer ngendlela engadibananga. Ngelixa usenza umyalelo wokukrola ngokukhawuleza, izixhobo ze-laser nazo zifuna ukupholiswa S&A UV laser chiller ukuqinisekisa ukukhanya okuzinzileyo kunye nokwanelisa imfuno yokumakisha echanekileyo ephezulu ye-wafer surface.Ukusuka kwingqolowa yesanti ukuya kwi-silicon wafer emva koko i-chip epheleleyo, kukho imfuno engqongqo yokuchaneka kwenkqubo yokuvelisa. Ukuchaneka kokumakishwa kweLaser ngokuqinisekileyo kudibaniswa nesisombululo esichanekileyo sokulawula ubushushu. S&A i-chiller ibonakala incinci kwinkqubo enzima kwaye edinayo yokuvelisa i-chip, kodwa isiqinisekiso esichanekileyo esichanekileyo sekhonkco eliphakathi, sinesiqinisekiso sokuchaneka okuneenkcukacha ezininzi apho itshiphu iya kwintsimi entsonkothileyo.
Ulawulo lobushushu obuchanekileyo kwiiNkqubo zeLaser kunye nezicelo zoShishino ukusukela ngo-2002
Ulwimi
