ʻAuhea ka Pōʻai Aʻe o ka Boom i ka Precision Laser Processing?

ʻAʻole i liʻuliʻu iki aku nei, ua hoʻolaha kūhelu ʻo Apple Inc. i ka hoʻokuʻu ʻia ʻana o ka hanauna hou o ka iPhone 14, e mālama ana i ka maʻamau o hoʻokahi hoʻohou i ka makahiki. Ua pūʻiwa ka nui o nā mea hoʻohana i ka "ua ulu ka iPhone i ka hanauna 14". A ua lanakila koke ia ma mua o 1 miliona mau hoʻopaʻa pūnaewele ma ka mākeke Kina. Ke kaulana nei ʻo iPhone i waena o ka poʻe ʻōpio.

Ua hoʻomaka nā Smartphones i ka pōʻai mua o ke koi no ka hana laser kikoʻī

ʻOi aku ma mua o hoʻokahi ʻumi makahiki i hala aku nei, i ka wā i hoʻokuʻu wale ʻia ai nā kelepona akamai, ua haʻahaʻa ka ʻenehana hana laser ʻoihana. He mea hou a hakahaka ka laser fiber a me ka laser ultrafast ma ka mākeke Kina, ʻaʻole e ʻōlelo i ka hana laser pololei. Mai ka makahiki 2011, ua hoʻopili mālie ʻia ka māka laser pololei haʻahaʻa ma Kina. I kēlā manawa, ua kūkākūkā ʻia ka laser ʻōmaʻomaʻo pulse paʻa liʻiliʻi a me ka laser ultraviolet. A i kēia manawa, ua hoʻohana mālie ʻia ka laser ultrafast no nā kumu kalepa, a ke kamaʻilio ʻia nei ka hana laser pololei ultrafast.

ʻO ka hoʻohana nui ʻana o ka hana laser precision e hoʻokele nui ʻia e ka hoʻomohala ʻana o nā kelepona akamai. ʻO ka hana ʻana o nā paheʻe kāmela, nā modula manamana lima, nā kī HOME, nā lua makapō kāmela, a me nā panela kelepona paʻalima ʻokiʻoki ʻano ʻē, a me nā mea ʻē aʻe, e pōmaikaʻi ana mai ka holomua ʻenehana o ka ʻoki pololei laser ultrafast. ʻO ka ʻoihana hana pololei o nā mea hana hana laser precision nui Kina mai nā mea uila mea kūʻai aku. ʻO ia hoʻi, ʻo ka pōʻai hope loa o ka ulu ʻana o ka hana laser precision e hoʻoikaika ʻia e nā mea uila mea kūʻai aku, ʻoi aku hoʻi nā kelepona akamai a me nā panela hōʻike.

ʻOki ʻana i ka Panel Laser

Mai ka makahiki 2021, ua hōʻike nā huahana mea kūʻai aku e like me nā kelepona akamai, nā kāʻei lima hiki ke hoʻohana ʻia a me nā panela hōʻike i kahi ʻano iho, e alakaʻi ana i ka nāwaliwali o ke koi no nā lako hana uila mea kūʻai aku a me ke kaomi nui ʻana i kona ulu ʻana. No laila hiki i ka iPhone14 hou ke hoʻomaka i kahi pōʻai hou o ka boom hana? Akā i ka hoʻoholo ʻana mai ke ʻano o kēia manawa ʻaʻole makemake nui ka poʻe e kūʻai i kahi kelepona hou, ua aneane maopopo ʻaʻole hiki i nā kelepona akamai ke kōkua i ka ulu hou ʻana o ke koi mākeke. ʻO 5G a me nā kelepona pelu i kaulana i kekahi mau makahiki i hala aku nei hiki ke lawe mai i kahi pani hapa. No laila, ma hea ka pōʻai aʻe o ka piʻi ʻana o ke koi i ka hana laser precision?

ʻO ka piʻi ʻana o ka ʻoihana semiconductor a me ka chip o Kina

He hale hana honua maoli ʻo Kina. I ka makahiki 2020, ʻo ka waiwai i hoʻohui ʻia o ka ʻoihana hana o Kina he 28.5% o ka mahele honua. ʻO ka ʻoihana hana nui o Kina e lawe mai ana i ka hiki ke kūʻai nui no ka hana ʻana a me ka hana ʻana i ka laser. Eia nō naʻe, he nāwaliwali ka hōʻiliʻili ʻenehana o ka ʻoihana hana o Kina i ka wā mua, a ʻo ka hapa nui o lākou he mau ʻoihana waena a me ka haʻahaʻa. Ua ʻike ʻia ka holomua nui i nā makahiki he ʻumi i hala iho nei i nā mīkini, ka halihali, ka ikehu, ka ʻenekinia moana, ka aerospace, nā lako hana, a me nā mea ʻē aʻe, me ka hoʻomohala ʻana i nā lasers a me nā lako laser, ka mea i hoʻemi nui i ka ʻokoʻa me ka pae holomua o ka honua.

Wahi a nā helu helu mai ka Semiconductor Industry Association, ʻo Kina ka ʻāina nui ka mea kūkulu fab wikiwiki loa o ka honua, me 31 mau fab nui e kālele ana i ke kaʻina hana makua e manaʻo ʻia e hoʻopau ʻia i ka hopena o 2024; Ua ʻoi aku ka wikiwiki ma mua o 19 mau fab i hoʻolālā ʻia e hoʻokomo ʻia ma Taiwan, Kina i ka manawa like, a me 12 mau fab i manaʻo ʻia ma ʻAmelika Hui Pū ʻIa.

ʻAʻole i liʻuliʻu aku nei, ua hoʻolaha ʻo Kina ua uhaʻi ka ʻoihana kaapuni hoʻohui ʻia o Shanghai i ke kaʻina hana chip 14nm a ua hoʻokō i kahi pae hana nui. No kekahi o nā chips ma luna o 28nm i hoʻohana ʻia i nā mīkini home, nā kaʻa a me nā kamaʻilio, ke kaena nei ʻo Kina ma mua o ke kaʻina hana makua, a hiki ke hoʻokō pono i ka noi holoʻokoʻa no ka hapa nui o nā chips i loko. Me ka hoʻolauna ʻana o ke kānāwai US CHIPS, ʻoi aku ka ikaika o ka hoʻokūkū ʻenehana chip ma waena o Kina a me ʻAmelika Hui Pū ʻIa, a aia paha he keu o ka lako. Ua ʻike ʻia ka makahiki 2021 i ka emi nui ʻana o ka lawe ʻana mai o nā chips mai Kina.

ʻĀpana Hana ʻia e ka Laser

ʻO ka laser i hoʻohana ʻia i ka hana ʻana i nā ʻāpana semiconductor

ʻO nā wafers nā mea kumu o nā huahana semiconductor a me nā ʻāpana, pono e hoʻopili ʻia me ka mīkini ma hope o ka ulu ʻana. I ke kahua hope, ʻo ka ʻoki ʻana i ka wafer, i ʻike ʻia hoʻi ʻo ka wafer dicing, he mea nui loa ia. Ua hoʻomohala ʻia a ua oʻo ka ʻenehana ʻoki wafer laser DPSS pōkole mua ma ʻEulopa a me ʻAmelika Hui Pū ʻIa. I ka piʻi ʻana o ka mana o nā lasers ultrafast, e lilo mālie ka hoʻohana ʻana iā ia i mea nui i ka wā e hiki mai ana, ʻoiai ma nā kaʻina hana e like me ka ʻoki ʻana i ka wafer, nā lua micro-drilling, nā hoʻāʻo beta pani. He nui ka hiki ke koi ʻia o nā lako laser ultrafast.

I kēia manawa, aia nā mea hana lako laser precision ma Kina e hiki ke hoʻolako i nā lako slotting wafer, hiki ke hoʻopili ʻia i ka slotting ʻili o nā wafers 12-'īniha ma lalo o ke kaʻina hana 28nm, a me nā lako ʻoki crypto wafer laser i hoʻopili ʻia i nā chips sensor MEMS, nā chips hoʻomanaʻo a me nā kahua hana chip kiʻekiʻe ʻē aʻe. I ka makahiki 2020, ua hoʻomohala kahi ʻoihana laser nui ma Shenzhen i nā lako debonding laser e hoʻomaopopo i ka hoʻokaʻawale ʻana o nā ʻāpana aniani a me silicon, a hiki ke hoʻohana ʻia nā lako e hana i nā chips semiconductor kiʻekiʻe.

ʻO ka Wafer Chip ʻokiʻoki Laser

I ka waena o 2022, ua hoʻomaka kahi ʻoihana laser ma Wuhan i nā lako ʻokiʻoki laser piha piha, kahi i hoʻopili pono ʻia i ka mālama ʻana i ka ʻili laser ma ke kahua o nā ʻāpana. Hoʻohana ka hāmeʻa i kahi laser femtosecond kiʻekiʻe a me ka ikehu pulse haʻahaʻa loa e hana i ka hoʻololi laser ma ka ʻili o nā mea semiconductor ma ka pae micron, no laila e hoʻomaikaʻi nui ai i ka hana o nā mea optoelectronic semiconductor. He kūpono nā lako no ke kumukūʻai kiʻekiʻe, nā kahawai haiki (≥20um) semiconductor compound SiC, GaAs, LiTaO3 a me nā ʻoki hoʻololi kūloko wafer chip ʻē aʻe, e like me nā ʻāpana silicon, nā ʻāpana sensor MEMS, nā ʻāpana CMOS, a pēlā aku.

Ke hoʻoponopono nei ʻo Kina i nā pilikia loea koʻikoʻi o nā mīkini lithography, ka mea e hoʻoulu ai i ke koi no nā lasers excimer a me nā lasers ultraviolet koʻikoʻi e pili ana i ka hoʻohana ʻana i nā mīkini lithography, akā he kakaikahi ka noiʻi ma kēia kahua ma mua ma Kina.

ʻO nā poʻo hana laser kikoʻī no ka hopena kiʻekiʻe a me nā ʻāpana e lilo paha i nalu hou o ka craze

Ma muli o ka nāwaliwali o ka ʻoihana ʻāpana semiconductor o Kina ma mua, ua liʻiliʻi ka noiʻi a me nā noi ma nā ʻāpana hana laser, i hoʻohana mua ʻia ma ka ʻākoakoa hope o nā huahana uila mea kūʻai ma hope. I ka wā e hiki mai ana, e neʻe mālie ka mākeke nui no ka hana laser pololei ma Kina mai ka hana ʻana o nā ʻāpana uila maʻamau i nā mea uka a me nā ʻāpana koʻikoʻi, ʻoiai ka hoʻomākaukau ʻana i nā mea semiconductor, biomedical, a me nā mea polymer.

E hoʻomohala ʻia nā kaʻina hana noi laser hou aʻe i ka ʻoihana chip semiconductor. No nā huahana chip kiʻekiʻe-kiko, ʻo ka hana optical non-contact ke ʻano kūpono loa. Me ke koi nui no nā chips, ʻo ka ʻoihana chip e hāʻawi nui i ka pōʻai aʻe o ke koi no nā lako hana laser precision.