Nūhou Laser
ʻO ka mana wela kūpono no nā ʻōnaehana Laser a me nā noi ʻoihana mai 2002
ʻLelo
Hoʻopau nā kelepona i ka pōʻai mua o ka noi no ka hoʻoponopono laser pololei. No laila ma hea ka piʻi ʻana o ka koi i ka hoʻoili ʻana i ka laser precision? ʻO nā poʻo hoʻoponopono laser kikoʻī no ka hopena kiʻekiʻe a hiki i nā chips ke lilo i ka nalu o ka craze.
ʻAʻole i liʻuliʻu, ua hoʻolaha ʻo Apple Inc. i ka hoʻokuʻu ʻana o ka hanauna hou o iPhone 14, e mālama ana i ka maʻamau o hoʻokahi mea hou i ka makahiki. Pīhoihoi nā mea hoʻohana he "ua hoʻomohala ʻo iPhone i ka hanauna 14". A lanakila koke ia ma luna o 1 miliona mau puke puke ma ka mākeke Kina. Ke kaulana nei ka iPhone me ka poʻe ʻōpio.
Hoʻopau nā kelepona i ka pōʻai mua o ka noi no ka hoʻoponopono laser pololei
ʻOi aku ma mua o hoʻokahi mau makahiki i hala aku nei, i ka wā i hoʻokuʻu ʻia ai nā smartphones, aia nō ka ʻenehana hana laser ʻenehana i kahi haʻahaʻa. ʻO ka fiber laser a me ka laser ultrafast he mau mea hou a blank i ka mākeke Kina, ʻaʻole ia e ʻōlelo i ka hoʻoponopono laser precision. Mai ka makahiki 2011, ua hoʻohana mālie ʻia ka hōʻailona laser precision haʻahaʻa ma Kina. I kēlā manawa, ua kūkākūkā ʻia ka laser ʻōmaʻomaʻo ikaika ikaika liʻiliʻi a me ka laser ultraviolet. A i kēia manawa, ua hoʻohana mālie ʻia ka laser ultrafast no nā kumu kūʻai, a ke kamaʻilio ʻia nei ka hana laser precision ultrafast.
Hoʻohana nui ʻia ka noi nui o ka hoʻoili laser precision e ka hoʻomohala kelepona. ʻO ka hana ʻana i nā kiʻi paʻi kiʻi paʻi kiʻi, nā modula manamana lima, nā kī HOME, nā puka makapō kamera, a me ke ʻano like ʻole o ka ʻoki ʻana i nā panela kelepona paʻalima, a me nā mea ʻē aʻe. ʻO ka ʻoihana hoʻoponopono kikoʻī o nā mea hana hoʻoponopono laser precision nui Kina mai nā mea uila uila. ʻO ia hoʻi, ʻo ka pōʻai hope loa o ka boom i ka hana laser precision e hoʻohana ʻia e nā mea uila uila, ʻoi aku ka nui o nā smartphones a me nā panela hōʻike.
ʻOki ʻana o ka Panel Laser
Mai ka makahiki 2021, ua hōʻike nā huahana mea kūʻai aku e like me nā smartphones, nā wristband hiki ke hoʻohana ʻia a me nā panela hōʻike i kahi hiʻohiʻona i lalo, e alakaʻi ana i kahi koi nāwaliwali no nā mea hana uila uila a me ka hoʻoikaika nui ʻana i kona ulu. No laila hiki i ka iPhone14 hou ke hoʻomaka i kahi pōʻai hou o ka boom hoʻoili? Akā i ka hoʻoholo ʻana mai ke ʻano o kēia manawa ʻaʻole makemake ka poʻe e kūʻai i kelepona hou, ʻaneʻane maopopo ʻaʻole hiki i nā smartphones ke kōkua i ka ulu hou o ka noi mākeke. ʻO 5G a me nā kelepona hiki ke hoʻopili ʻia i kaulana i kekahi mau makahiki i hala aku nei hiki ke lawe mai i kahi pani hakahaka.No laila, ma hea ka piʻi ʻana o ka noi i ka hoʻoili ʻana i ka laser precision?
ʻO ka piʻi ʻana o ka semiconductor a me ka ʻoihana chip
ʻO Kina kahi hale hana honua maoli. I ka makahiki 2020, ʻo ka waiwai i hoʻohui ʻia o ka ʻoihana hana hana o Kina he 28.5% o ka māhele honua. ʻO ia ka ʻoihana hana nui Kina e lawe mai i ka mākeke nui no ka hoʻoili ʻana a me ka hana ʻana i ka laser. Eia nō naʻe, ʻoi aku ka nāwaliwali o ka ʻenehana hana ʻana o Kina i ka wā mua, a ʻo ka hapa nui o lākou he ʻoihana waena a haʻahaʻa. ʻO nā makahiki he ʻumi i hala aku nei ua ʻike i ka holomua nui o ka mīkini, ka lawe ʻana, ka ikehu, ka ʻenekinia moana, aerospace, nā mea hana hana, a me nā mea ʻē aʻe, me ka hoʻomohala ʻana i nā lasers a me nā mea hana laser, ka mea i hōʻemi nui i ke āpau me ka pae kiʻekiʻe o ka honua.
Wahi a nā helu helu mai Semiconductor Industry Association, ʻo ka ʻāina nui ʻo Kina ka mea hana wikiwiki loa o ka honua, me 31 mau mea hana nui e nānā ana i ke kaʻina hana i manaʻo ʻia e hoʻopau ʻia i ka hopena o 2024; Ua ʻoi aku ka wikiwiki ma mua o ka 19 fabs i hoʻonohonoho ʻia e hana ʻia ma Taiwan, Kina i ka manawa like, a me nā 12 fabs i manaʻo ʻia ma ʻAmelika Hui Pū ʻIa.
ʻAʻole i liʻuliʻu, ua hoʻolaha ʻo Kina ua haki ka ʻoihana kaʻapuni hoʻohui ʻia ʻo Shanghai ma ke kaʻina hana chip 14nm a loaʻa i kahi ʻano hana nui. No kekahi o nā chips ma luna o 28nm i hoʻohana ʻia i nā mea pono home, nā kaʻa a me nā kamaʻilio, ua haʻaheo ʻo Kina i ke kaʻina hana oʻo, a hiki ke hoʻokō pono i ka noi holoʻokoʻa no ka hapa nui o nā chips i loko. Me ka hoʻokomo ʻia ʻana o ka US CHIPS Act, ʻoi aku ka ikaika o ka hoʻokūkū ʻenehana chip ma waena o Kina a me ʻAmelika Hui Pū ʻIa, a aia paha ke koena lako. 2021 ua ʻike i ka emi nui o ka lawe ʻana mai o Kina i nā chips.
Chip i hana ʻia me ka Laser
ʻO ka laser i hoʻohana ʻia i ka hana ʻana i nā chips semiconductor
ʻO nā wafers nā mea kumu o nā huahana semiconductor a me nā ʻāpana, pono e hoʻoliʻi ʻia ma hope o ka ulu ʻana. I ka pae hope loa, he mea nui ka ʻoki ʻana i ka wafer, i ʻike ʻia hoʻi ʻo ka wafer dicing. Ua hoʻomohala ʻia ka ʻenehana ʻokiʻoki wafer laser DPSS pōkole pōkole mua i ʻEulopa a me ʻAmelika Hui Pū ʻIa. Ke piʻi aʻe nei ka mana o nā laser ultrafast, e lilo ka hoʻohana ʻana iā ia i mea nui i ka wā e hiki mai ana, ʻoi aku hoʻi i nā kaʻina hana e like me ka ʻoki ʻana i ka wafer, nā lua micro-drilling, nā hoʻāʻo beta pani. ʻOi aku ka nui o ka pono o nā lako laser ultrafast.
I kēia manawa, aia nā mea hana hana laser precision ma Kina e hiki ke hāʻawi i nā lako wafer slotting, hiki ke hoʻopili ʻia i ka slotting ili o nā wafers 12-inch ma lalo o ke kaʻina hana 28nm, a me nā mea ʻokiʻoki wafer crypto laser i hoʻohana ʻia i nā chip sensor MEMS, nā pahu hoʻomanaʻo a me nā mea ʻē aʻe. kiʻekiʻe-hope chip hana kīhāpai. I ka makahiki 2020, ua hoʻomohala kahi ʻoihana laser nui ma Shenzhen i nā lako debonding laser e ʻike ai i ka hoʻokaʻawale ʻana o nā aniani a me nā ʻāpana silika, a hiki ke hoʻohana ʻia nā mea hana e hana i nā chip semiconductor kiʻekiʻe.
ʻOki ʻoki ʻoki ʻoki ʻana i ke kīpē
I ka waena waena o 2022, ua hoʻomaka ka ʻoihana laser ma Wuhan i nā mea ʻoki ʻoki ʻoki ʻokiʻoki i hoʻololi ʻia i ka laser, i hoʻohana maikaʻi ʻia i ka mālama ʻana i ka laser surface ma ke kahua o nā chips. Hoʻohana ka mea hana i ka laser femtosecond kiʻekiʻe a me ka ikehu pulse haʻahaʻa loa e hana i ka hoʻololi ʻana i ka laser ma ka ʻili o nā mea semiconductor i loko o ka micron range, pēlā e hoʻomaikaʻi nui ai i ka hana o nā mea semiconductor optoelectronic. Ua kūpono nā mea hana no ke kumu kūʻai kiʻekiʻe, ke ala liʻiliʻi (≥20um) hui semiconductor SiC, GaAs, LiTaO3 a me nā pahu wafer chip ʻoki hoʻololi i loko, e like me nā chips silicon, MEMS sensor chips, CMOS chips, etc.
Ke hoʻopiʻi nei ʻo Kina i nā pilikia ʻenehana nui o nā mīkini lithography, kahi e koi ai i ka noi no nā laser excimer a me nā lasers ultraviolet loa e pili ana i ka hoʻohana ʻana i nā mīkini lithography, akā he liʻiliʻi ka noiʻi ma kēia kahua ma Kina.
ʻO nā poʻo hoʻoponopono laser kikoʻī no ka hopena kiʻekiʻe a hiki i nā chips ke lilo i ka nalu o ka craze
Ma muli o ka nāwaliwali o ka ʻoihana chip semiconductor ma Kina ma mua, ʻaʻole liʻiliʻi ka noiʻi a me nā noi e pili ana i nā ʻāpana hoʻoheheʻe laser, i hoʻohana mua ʻia i ka hui hope o nā huahana uila o lalo. I ka wā e hiki mai ana, e neʻe mālie ka mākeke nui no ka hoʻoili laser precision ma Kina mai ka hana ʻana o nā ʻāpana uila maʻamau i nā mea upstream a me nā mea nui, ʻoi aku ka hoʻomākaukau ʻana i nā mea semiconductor, biomedical, a me nā mea polymer.
E hoʻonui ʻia nā kaʻina noi laser i ka ʻoihana semiconductor chip. No nā huahana chip kiʻekiʻe, ʻo ka hoʻoili optical non-contact ke ala kūpono loa. Me ka koi nui no nā chips, hiki i ka ʻoihana chip ke hāʻawi nui i ka pōʻai aʻe o ka noi no nā mea hoʻoponopono laser precision.
Aia mākou ma ʻaneʻi no ʻoe ke makemake ʻoe iā mākou.
E ʻoluʻolu e hoʻopiha i ka palapala e hoʻokaʻaʻike mai iā mākou, a hauʻoli mākou e kōkua iā ʻoe.
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Ua hoʻokumu ʻia ʻo TEYU S&A Chiller ma 2002 me 23 mau makahiki o ka ʻike hana chiller, a i kēia manawa ua ʻike ʻia ʻo ia he paionia ʻenehana hoʻoluʻu a he hoa hilinaʻi i ka ʻoihana laser.
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