Uphi uMjikelo olandelayo weBoom kwiProcessing yeLaser echanekileyo?

Kungekudala, iApple Inc. ibhengeze ngokusemthethweni ukukhutshwa kwesizukulwana esitsha se-iPhone 14, ukugcina umkhwa wohlaziyo olunye ngonyaka. Abasebenzisi abaninzi bothuswa kukuba "i-iPhone iphuhliselwe kwisizukulwana se-14". Kwaye ngokukhawuleza yaphumelela ngaphezulu kwesigidi esi-1 sokubhukisha kwi-intanethi kwimarike yaseTshayina. IPhone isathandwa ngabantu abatsha.

Ii-smartphones zaqalisa umjikelo wokuqala wemfuno yokulungiswa kwelaser echanekileyo

Ngaphezu kweshumi leminyaka eyadlulayo, xa ii-smartphones zazisandula ukusungulwa, itekhnoloji yokusetyenzwa kwe-laser yoshishino yayisekwinqanaba eliphantsi. I-laser ye-fiber kunye ne-ultrafast laser yayizizinto ezintsha kwaye zingenanto kwimarike yaseTshayina, ndingathethi ukucocwa kwe-laser. Ukusukela ngo-2011, ukumakishwa kwe-laser echanekileyo kwisiphelo esisezantsi kuye kwasetyenziswa ngokuthe ngcembe e-China. Ngelo xesha, kwaxoxwa ngelaser eluhlaza kunye ne-ultraviolet laser. Kwaye ngoku, i-laser ye-ultrafast ithe ngokuthe ngcembe isetyenziselwa iinjongo zorhwebo, kwaye kuthethwa ngayo ngokucokisekileyo kwe-laser echanekileyo.

Ukusetyenziswa kobuninzi bokuchaneka kwe-laser processing ikakhulu kuqhutywa luphuhliso lwe-smartphone. Ukuveliswa kwezilayidi zekhamera, iimodyuli zeminwe, izitshixo ze-HOME, izimbobo ezingaboniyo zekhamera, kunye nokusika okungaqhelekanga kwimilo yeefowuni eziphathwayo, njl. Ishishini lokulungisa ngokuchanekileyo labakhiqizi abaphambili baseTshayina be-laser baseChina livela kubathengi be-elektroniki. Oko kukuthi, umjikelo wokugqibela we-boom ekusetyenzweni kwe-laser echanekileyo inikwa amandla ngabathengi be-elektroniki, ngakumbi ii-smartphones kunye neepaneli zokubonisa.

Iphaneli yeLaser yokusika

Ukusukela ngo-2021, iimveliso zabathengi ezinjengee-smartphones, ii-wristbands ezinxitywayo kunye neepaneli zokubonisa zibonise indlela ehlayo, ekhokelela kwimfuno ebuthathaka yezixhobo zokulungisa izixhobo zombane kunye noxinzelelo olukhulu ekukhuleni kwayo. Ke ngaba i-iPhone14 entsha ingaqala umjikelo omtsha wokusetyenzwa kwe-boom? Kodwa ngokujonga imeko yangoku yokuba abantu abazimisele kangako ukuthenga ifowuni entsha, phantse ngokuqinisekileyo ukuba ii-smartphones azinakufaka isandla ekukhuleni okutsha kwimfuno yentengiso. I-5G kunye neefowuni ezisongekayo ezidume kwiminyaka embalwa edlulileyo zinokuzisa indawo yesitokhwe. Ke, umjikelo olandelayo wokunyuka kwemfuno ekusetyenzweni kwelaser echanekileyo unokuba kuphi?

Ukunyuka kweshishini le-semiconductor yaseChina kunye ne-chip

I-China ngumzi-mveliso wehlabathi wokwenyani. Ngo-2020, ixabiso elongezelelweyo loshishino lwemveliso yaseTshayina libalelwa kwi-28.5% yesabelo sehlabathi. Lishishini elikhulu laseTshayina lemveliso elizisa amandla amakhulu okuthengisa ukusetyenzwa kwelaser kunye nokwenza. Nangona kunjalo, ishishini lokuvelisa laseTshayina linoqokelelo olubuthathaka lobugcisa kwinqanaba lokuqala, kwaye uninzi lwazo ngamashishini aphakathi kunye nasekupheleni. Iminyaka elishumi edlulileyo ibone inkqubela phambili enkulu koomatshini, ukuthutha, amandla, ubunjineli baselwandle, i-aerospace, izixhobo zokuvelisa, njl., kubandakanywa nophuhliso lwe-laser kunye nezixhobo ze-laser, eziye zanciphisa kakhulu i-gap kunye nenqanaba eliphezulu lamazwe ngamazwe.

Ngokweenkcukacha-manani ezisuka kwiSemiconductor Industry Association, ilizwe lase China ngoyena makhi we-fab okhawulezayo kwihlabathi, ngamalaphu angama-31 amakhulu agxile kwinkqubo esele ikhulile elindeleke ukuba igqitywe ekupheleni kuka-2024; Isantya sigqithise kakhulu kwii-fabs ze-19 ezicwangciselwe ukuba zisetyenziswe eTaiwan, e-China ngexesha elifanayo, kunye neendwangu ezili-12 ezilindelekileyo e-United States.

Kungekudala, i-China yabhengeza ukuba ishishini lesekethe elidibeneyo lase-Shanghai liphule inkqubo ye-chip ye-14nm kwaye lafumana isikali esithile sokuvelisa ubunzima. Kwezinye zeetshiphusi ezingaphezulu kwe-28nm ezisetyenziswa kwizixhobo zasekhaya, iimoto kunye nonxibelelwano, i-China izidla ngokugqithisela inkqubo yokuvelisa eqolileyo, kwaye inokwanelisa ngokugqibeleleyo imfuno egcweleyo yeechips ezininzi ngaphakathi. Ngokusungulwa kwe-US I-CHIPS Act, ukhuphiswano lobuchwephesha be-chip phakathi kwe-China ne-United States luqina ngakumbi, kwaye kunokubakho intsalela yonikezelo. 2021  ibone ukwehla okubonakalayo kokungeniswa kweetshiphusi eTshayina.

Laser Processed Chip

I-laser esetyenziswa kwi-semiconductor chips processing

I-Wafers zizinto ezisisiseko zeemveliso ze-semiconductor kunye neechips, ezifuna ukucocwa ngoomatshini emva kokukhula. Kwinqanaba lamva, ukusika i-wafer, okwakwaziwa njenge-wafer dicing, kubaluleke kakhulu. Itekhnoloji yokusika i-laser ye-laser ye-DPSS yasekuqaleni iphuhlisiwe kwaye yakhula eYurophu nase-United States. Njengoko amandla e-laser esanda ngokukhawuleza, ukusetyenziswa kwayo kuya kuba yeyona nto iphambili kwixesha elizayo, ngakumbi kwiinkqubo ezinje ngokusikwa kwe-wafer, imingxunya emincinci, iimvavanyo ze-beta ezivaliweyo. Amandla emfuno yezixhobo zelaser makhulu ngokuthelekisa.

Ngoku, kukho abavelisi bezixhobo ze-laser ezichanekileyo e-China ezinokubonelela ngezixhobo zokubeka i-wafer, ezinokuthi zisetyenziswe kwindawo yokubeka i-12-intshi ye-wafers phantsi kwenkqubo ye-28nm, kunye nezixhobo zokusika i-laser wafer crypto ezisetyenziswa kwi-MEMS sensor chips, imemori chips kunye namanye amasimi okuvelisa i-chip ephezulu. Ngo-2020, ishishini elikhulu le-laser e-Shenzhen liphuhlise izixhobo zokudibanisa i-laser ukuze ziqonde ukwahlulwa kweglasi kunye nezilayi ze-silicon, kwaye izixhobo zingasetyenziselwa ukuvelisa iitshiphusi eziphezulu ze-semiconductor.

Laser Ukusika Chip Wafer

Embindini we-2022, ishishini le-laser e-Wuhan laqala ngezixhobo zokusika ezi-automatic-modified laser, ezathi zasetyenziswa ngempumelelo kunyango lomphezulu we-laser kwintsimi yeetshiphusi. Isixhobo sisebenzisa i-laser ye-femtosecond ye-high-precision ephezulu kunye namandla aphantsi kakhulu e-pulse ukwenza ukuguqulwa kwe-laser ebusweni bezinto ze-semiconductor kuluhlu lwe-micron, ngaloo ndlela iphucula kakhulu ukusebenza kwezixhobo ze-semiconductor optoelectronic. Isixhobo sifanelekile kwiindleko eziphezulu, i-channel-incinci (≥ 20um) i-semiconductor edibeneyo ye-SiC, i-GaAs, i-LiTaO3 kunye nezinye i-wafer chip yangaphakathi yokusika ukuguqulwa kwangaphakathi, njenge-silicon chips, i-MEMS sensor chips, i-CMOS chips, njl. 

I-China ijongene neengxaki eziphambili zobuchwepheshe zoomatshini be-lithography, eziya kuqhuba imfuno ye-laser ye-excimer kunye ne-laser ye-ultraviolet egqithisileyo enxulumene nokusetyenziswa koomatshini be-lithography, kodwa kukho uphando oluncinci kule ntsimi ngaphambili e-China.

Iintloko ezichanekileyo zokusetyenzwa kwe-laser kwisiphelo esiphezulu kwaye iitshiphusi zinokuba liza le-craze elilandelayo

Ngenxa yobuthathaka kwishishini letshiphu ye-semiconductor yaseTshayina ngaphambili, bekukho uphando oluncinci kunye nezicelo kwiitshiphu zokusetyenzwa kwelaser, eziye zasetyenziswa okokuqala kwindibano yesiphelo yeemveliso zombane ezisezantsi zabathengi. Kwixesha elizayo, imarike ephambili yokulungiswa kwe-laser echanekileyo e-China iya kuhamba ngokuthe ngcembe ukusuka ekusetyenzweni kwamalungu e-elektroniki ngokubanzi ukuya kwimathiriyeli ephezulu kunye namacandelo aphambili, ngakumbi ukulungiswa kwemathiriyeli ye-semiconductor, i-biomedical, kunye nemathiriyeli ye-polymer.

Ziya kukhula ngakumbi iinkqubo zokufakwa kwelaser kushishino lwetshiphu ye-semiconductor ziya kuphuhliswa. Kwiimveliso ze-chip ezichanekileyo, ukucocwa kwe-optical non-contact yeyona ndlela ifanelekileyo. Ngemfuno enkulu yeetshiphusi, ishishini letshiphu kunokwenzeka ukuba libe negalelo kumjikelo olandelayo wemfuno yezixhobo ezichanekileyo zokusetyenzwa kwelaser.