Taolo e Nepahetseng ea Mocheso bakeng sa Litsamaiso tsa Laser le Lisebelisoa tsa Indasteri Ho tloha ka 2002
Puo
Li-smartphone li thehile mokhahlelo oa pele oa tlhokomeliso e nepahetseng ea laser. Joale potoloho e latelang ea tlhokeho ea ts'ebetso ea laser e nepahetseng e ka ba kae? Lihlooho tse sebetsang hantle tsa laser bakeng sa maemo a holimo le li-chips li ka fetoha leqhubu le latelang la bohlanya.
Haufinyane tjena, Apple Inc. e phatlalalitse ka molao tokollo ea moloko o mocha oa iPhone 14, ho boloka tloaelo ea ntlafatso e le 'ngoe ka selemo. Basebelisi ba bangata ba maketse hore "iPhone e tsoetse pele ho isa molokong oa bo14". 'Me ka potlako e hapile lipehelo tse fetang milione tse 1 'marakeng oa China. iPhone e ntse e ratoa ke bacha.
Li-smartphone li thehile mokhahlelo oa pele oa tlhokomeliso e nepahetseng ea laser
Lilemong tse fetang leshome tse fetileng, ha li-smartphone li sa tsoa qalisoa, theknoloji ea ho sebetsa ka laser ea indasteri e ne e ntse e le boemong bo tlaase. Fiber laser le ultrafast laser e ne e le lintho tse ncha le tse se nang letho 'marakeng oa Chaena, ho sa thoe letho ka mokhoa o nepahetseng oa laser. Ho tloha ka 2011, letšoao la laser la boemo bo tlase le 'nile la sebelisoa butle-butle Chaena. Ka nako eo, ho ne ho buisanoa ka laser ea matla a manyenyane a matla a pulse green le ultraviolet laser. 'Me joale, laser ea ultrafast e se e ntse e sebelisoa butle-butle molemong oa khoebo,' me ho ntse ho buuoa ka ultrafast precision laser processing.
Ts'ebeliso e kholo ea ts'ebetso ea laser e nepahetseng e tsamaisoa haholo ke nts'etsopele ea li-smartphone. Lihlahisoa tsa li-slide tsa khamera, li-module tsa menoana, linotlolo tsa HOME, masoba a foufetseng a k'hamera, le ho khaola liphanele tsa mohala oa selefouno ka sebopeho se sa tloaelehang, joalo-joalo, kaofela li rua molemo ho nts'etsopele ea theknoloji ea ho itšeha ka mokhoa o hlakileng oa laser. Khoebo ea ho sebetsa ka nepo ea bahlahisi ba ka sehloohong ba China laser precision processing e tsoa ho lisebelisoa tsa elektroniki tsa bareki. Ka mantsoe a mang, potoloho ea ho qetela ea ts'ebetso ea laser e nepahetseng e tsamaisoa ke lisebelisoa tsa elektroniki tsa bareki, haholo li-smartphone le liphanele tsa ponts'o.
Laser Panel Cutting
Ho tloha ka 2021, lihlahisoa tsa bareki tse kang li-smartphones, li-wristbands le liphanele tse bonts'itsoeng li bonts'itse boemo bo tlase, bo lebisang tlhokahalong e fokolang ea lisebelisoa tsa ho lokisa lisebelisoa tsa elektroniki le khatello e kholo kholong ea eona. Joale na iPhone14 e ncha e ka qala potoloho e ncha ea ho sebetsa? Empa ho latela mokhoa oa hajoale oa hore batho ha ba batle ho reka mohala o mocha, ho hlakile hore li-smartphones li ke ke tsa kenya letsoho kholong e ncha ea tlhokahalo ea mmaraka. 5G le mehala ea mehala e tsebahalang lilemong tse 'maloa tse fetileng e ka tlisa phetoho e sa fellang ea stock.Joale, potoloho e latelang ea tlhokahalo e ntseng e eketseha ea ts'ebetso ea laser e nepahetseng e ka ba kae?
Ho phahama ha indasteri ea semiconductor ea China le chip
China ke feme ea sebele ea lefatše. Ka 2020, boleng bo ekelitsoeng ba indasteri ea tlhahiso ea China bo nka karolo ea 28.5% ea karolo ea lefats'e. Ke indasteri e kholo ea tlhahiso ea China e tlisang menyetla e mengata ea mmaraka bakeng sa ts'ebetso ea laser le tlhahiso. Leha ho le joalo, indasteri ea tlhahiso ea China e na le pokello e fokolang ea tekheniki qalong, 'me boholo ba eona ke liindasteri tse bohareng le tse tlase. Lilemong tse leshome tse fetileng ho bile le tsoelo-pele e kholo mecheng, lipalangoang, matla, boenjiniere ba likepe, sefofane, lisebelisoa tsa tlhahiso, joalo-joalo, ho kenyeletsoa nts'etsopele ea lisebelisoa tsa lasers le laser, tse fokolitseng haholo lekhalo le boemo bo tsoetseng pele ba machaba.
Ho ea ka lipalo-palo tse tsoang ho Semiconductor Industry Association, naha ea China ke sehahi sa masela se lebelo ka ho fetisisa lefatšeng, se nang le masela a maholo a 31 a shebaneng le ts'ebetso e butsoitseng e lebelletsoeng ho phethoa bofelong ba 2024; Lebelo le feta haholo masela a 19 a reretsoeng ho sebelisoa Taiwan, Chaena nakong eona eo, hammoho le masela a 12 a lebelletsoeng United States.
Haufinyane tjena, China e phatlalalitse hore indasteri ea potoloho e kopaneng ea Shanghai e se e phunyeletse ts'ebetsong ea chip ea 14nm mme e fihletse tekanyo e itseng ea tlhahiso ea bongata. Bakeng sa tse ling tsa lichifi tse kaholimo ho 28nm tse sebelisoang lisebelisoa tsa lapeng, likoloi le likhokahano, China e ithorisa ka ts'ebetso ea tlhahiso e tsoetseng pele, 'me e ka fihlela tlhoko ea kakaretso ea lichifi tse ngata kahare. Ka kenyelletso ea U.S. CHIPS Act, tlholisano ea theknoloji ea chip lipakeng tsa China le United States e matla le ho feta, 'me ho ka ba le phaello ea phepelo. 2021 e bone ho fokotseha ho hoholo ha theko ea China ea kantle ho naha.
Chip e entsoeng ka Laser
Laser e sebelisoang ha ho etsoa li-chips tsa semiconductor
Li-wafers ke lisebelisoa tsa mantlha tsa lihlahisoa tsa semiconductor le li-chips, tse hlokang ho belisoa ka mochini kamora ho hola. Ha nako e ntse e ea, ho khaola liphaephe, tse tsejoang hape ka hore ke li-wafer dicing, ho bohlokoa haholo. Theknoloji ea pele-pele ea DPSS laser wafer cuting e se e ntlafalitsoe le ho holisoa Europe le United States. Ha matla a li-lasers tsa ultrafast a ntse a eketseha, ts'ebeliso ea eona butle-butle e tla fetoha ntho e ka sehloohong nakong e tlang, haholo-holo mekhoeng e kang ea ho itšeha, likoti tsa ho cheka tse nyenyane, liteko tsa beta tse koetsoeng. Bokhoni ba tlhokahalo ea lisebelisoa tsa laser tse potlakileng haholo bo boholo ha bo bapisoa.
Hona joale, ho na le bahlahisi ba lisebelisoa tsa laser tse nepahetseng tsa China tse ka fanang ka lisebelisoa tsa ho roala li-wafer, tse ka sebelisoang holim'a marang-rang a li-wafers tse 12-inch tlas'a ts'ebetso ea 28nm, le lisebelisoa tsa laser wafer crypto cutting tse sebelisoang ho MEMS sensor chips, memory chips le tse ling. masimo a phahameng a ho etsa li-chip. Ka 2020, khoebo e kholo ea laser e Shenzhen e ile ea theha lisebelisoa tsa laser debonding ho lemoha karohano ea likhalase tsa khalase le silicon, 'me lisebelisoa li ka sebelisoa ho hlahisa lichifi tsa semiconductor tse phahameng haholo.
Laser Cutting Chip Wafer
Bohareng ba 2022, khoebo ea laser e Wuhan e ile ea qala ka lisebelisoa tsa ho itšeha tse fetotsoeng ka laser, tse ileng tsa sebelisoa ka katleho kalafong ea laser holim'a lebaleng la lichifi. Sesebelisoa se sebelisa laser ea femtosecond e phahameng ka ho fetesisa le matla a tlase haholo a pulse ho etsa phetoho ea laser holim'a lisebelisoa tsa semiconductor sebakeng sa micron, kahoo e ntlafatsa haholo ts'ebetso ea lisebelisoa tsa semiconductor optoelectronic. Thepa e loketse bakeng sa theko e phahameng, e moqotetsane-channel (≥20um) semiconductor SiC, GaAs, LiTaO3 le tse ling tsa wafer chip internal modification cutting, tse kang silicon chips, MEMS sensor chips, CMOS chips, joalo-joalo.
China e sebetsana le mathata a bohlokoa a tekheniki a mechini ea lithography, e tla tsamaisa tlhoko ea li-laser tsa excimer le lasers e feteletseng ea ultraviolet e amanang le ts'ebeliso ea mechini ea lithography, empa ho na le lipatlisiso tse nyane lefapheng lena pele ho China.
Lihlooho tse sebetsang hantle tsa laser bakeng sa maemo a holimo le li-chips li ka fetoha leqhubu le latelang la bohlanya
Ka lebaka la bofokoli ba indasteri ea li-semiconductor ea China pele, ho ne ho e-na le lipatlisiso tse fokolang le lisebelisoa tsa lisebelisoa tsa laser processing chips, tse ileng tsa sebelisoa pele kopanong ea ho qetela ea lihlahisoa tsa elektroniki tsa bareki. Nakong e tlang, 'maraka o ka sehloohong oa ho sebetsa ka mokhoa o nepahetseng oa laser Chaena o tla tloha butle-butle ho tloha ts'ebetsong ea likarolo tse akaretsang tsa elektroniki ho ea ho lisebelisoa tse ka holimo le likarolo tsa bohlokoa, haholo-holo ho lokisoa ha thepa ea semiconductor, biomedical le polymer.
Lits'ebetso tse ntseng li eketseha tsa ts'ebeliso ea laser indastering ea li-semiconductor chip li tla ntlafatsoa. Bakeng sa lihlahisoa tse phahameng tsa chip, ho se kopane le optical processing ke mokhoa o loketseng ka ho fetisisa. Ka tlhokahalo e kholo ea lichifi, indasteri ea li-chip e kanna ea kenya letsoho molemong o latelang oa tlhoko ea lisebelisoa tse nepahetseng tsa laser.
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TEYU S&A Chiller e thehiloe ka 2002 ka boiphihlelo ba lilemo tse 21 tsa tlhahiso ea chiller, 'me hona joale e amoheloa e le pula-maliboho oa theknoloji ea pholiso le molekane ea tšepahalang indastering ea laser.
Copyright © 2021 TEYU S&A Chiller - Litokelo tsohle li sirelelitsoe.
