Chip is the core technological product in the information era. It was born of a grain of sand. The semiconductor material used in the chip is monocrystalline silicon and the core component of sand is silicon dioxide. Going through the silicon smelting, purification, high temperature shaping and rotary stretching, sand becomes the monocrystalline silicon rod, and after cutting, grinding, slicing, chamfering and polishing, silicon wafer is finally made. Silicon wafer is the basic material for semiconductor chip manufacture. To meet the requirements of quality control and process improvement and facilitate the management and tracking of wafers in subsequent manufacturing testing and packaging processes, specific marks such as clear characters or QR codes can be engraved on the surface of the wafer or crystal particle. Laser marking uses high-energy beam to irradiate wafer in a non-contact way. While executing the engraving instruction quickly, the laser equipment also needs to be coole...