Iphi iRound elandelayo yeBoom kwiPrecision Laser Processing?

Kutshanje, iApple Inc. ibhengeze ngokusesikweni ukukhutshwa kwesizukulwana esitsha se-iPhone 14, igcina umkhwa wokuhlaziya kube kanye ngonyaka. Abasebenzisi abaninzi bayothuka kukuba "i-iPhone ikhule yaya kwisizukulwana se-14". Kwaye ngokukhawuleza iphumelele ukubhukisha kwi-intanethi ngaphezulu kwesigidi kwimarike yaseTshayina. I-iPhone isathandwa ngabantu abancinci.

Iifowuni ziqalise umjikelo wokuqala wemfuno yokucubungula ngokuchanekileyo nge-laser

Kwiminyaka engaphezu kweshumi eyadlulayo, xa ii-smartphones zazisandula ukuqaliswa, ubuchwepheshe bokucubungula i-laser yemizi-mveliso babusekwinqanaba eliphantsi. I-laser yefayibha kunye ne-laser ye-ultrafast yayizizinto ezintsha kwaye zingenanto kwimarike yaseTshayina, ingasathethwa ke ngokusebenza kwe-laser echanekileyo. Ukusukela ngo-2011, ukumakishwa kwe-laser echanekileyo ephantsi kuye kwasetyenziswa kancinci kancinci eTshayina. Ngelo xesha, i-laser eluhlaza enamandla amancinci kunye ne-laser ye-ultraviolet kwaxoxwa ngayo. Ngoku, i-laser ye-ultrafast iye yasetyenziswa kancinci kancinci kwiinjongo zorhwebo, kwaye ukusetyenzwa kwe-laser echanekileyo ye-ultrafast kuxoxwa ngayo.

Ukusetyenziswa okukhulu kwe-accuracy laser processing kuqhutywa kakhulu kuphuhliso lwee-smartphone. Iimveliso zee-camera slides, ii-fingerprint modules, i-HOME keys, ii-camera blind holes, kunye nee-mobile phone cutting-shape-irradically-shaped, njl.njl., zonke ziyazuza kwi-technology through of ultrafast laser precision cutting. Ishishini le-accuracy processing labavelisi abaphambili be-laser processing baseTshayina livela kwi-electronics zabathengi. Oko kukuthi, umjikelo wokugqibela we-boom in precision laser processing uqhutywa yi-electronics zabathengi, ngakumbi ii-smartphones kunye nee-display panels.

Ukusika iphaneli yeLaser

Ukususela ngo-2021, iimveliso zabathengi ezifana neefowuni eziphathwayo, iibhanti zesandla ezinxitywayo kunye neepaneli zokubonisa zibonakalise umkhwa wokuhla, okukhokelela kwimfuno ebuthathaka yezixhobo zokucubungula izixhobo ze-elektroniki zabathengi kunye noxinzelelo olukhulu ekukhuleni kwayo. Ngaba i-iPhone14 entsha ingaqalisa umjikelo omtsha wokukhula kokucubungula? Kodwa xa sijonga umkhwa wangoku wokuba abantu abazimisele kangako ukuthenga ifowuni entsha, kuqinisekile ukuba iifowuni eziphathwayo azinakufaka isandla ekukhuleni okutsha kwemfuno yemarike. Iifowuni ze-5G kunye nezisongekayo ezazidumile kwiminyaka embalwa eyadlulayo zinokuzisa nje indawo yesitokhwe esincinci. Ke, umjikelo olandelayo wokunyuka kwemfuno ekucutshungulweni kwe-laser echanekileyo unokuba phi?

Ukunyuka kweshishini le-semiconductor kunye ne-chip eTshayina

I-China ngumzi-mveliso wehlabathi othembekileyo. Ngo-2020, ixabiso elongezelelekileyo leshishini lokuvelisa laseTshayina libalelwa kwi-28.5% yesabelo sehlabathi. Lishishini elikhulu lokuvelisa laseTshayina elizisa amandla amakhulu emarike yokucubungula kunye nokuvelisa nge-laser. Nangona kunjalo, ishishini lokuvelisa laseTshayina linokuqokelelana kobuchwephesha obuthathaka kwinqanaba lokuqala, kwaye uninzi lwalo ngamashishini aphakathi naphantsi. Kwiminyaka elishumi edlulileyo ibone inkqubela phambili enkulu koomatshini, ezothutho, amandla, ubunjineli baselwandle, i-aerospace, izixhobo zokuvelisa, njl.njl., kubandakanya uphuhliso lwe-laser kunye nezixhobo ze-laser, ezinciphise kakhulu umsantsa kwinqanaba eliphezulu lamazwe ngamazwe.

Ngokwezibalo ezivela kwi-Semiconductor Industry Association, ilizwe laseTshayina lelona qela likhawulezayo emhlabeni ukwakha izinto ezintsha, kunye neefektri ezinkulu ezingama-31 ezigxile kwinkqubo yokuvuthwa kulindeleke ukuba zigqitywe ekupheleni kuka-2024; Isantya sidlule kakhulu kwiifektri ezili-19 ezicwangciselwe ukusebenza eTaiwan, eTshayina ngexesha elifanayo, kunye neefektri ezili-12 ezilindelweyo eMelika.

Kutshanje, iTshayina ibhengeze ukuba ishishini leesekethe ezihlanganisiweyo zaseShanghai lidlule kwinkqubo yeetshiphusi ze-14nm kwaye lifikelele kwinqanaba elithile lemveliso ngobuninzi. Kwezinye zeetshiphusi ezingaphezulu kwe-28nm ezisetyenziswa kwizixhobo zasekhaya, kwiimoto nakwiindlela zonxibelelwano, iTshayina izingca ngokugqitha inkqubo yemveliso evuthiweyo, kwaye inokuhlangabezana ngokugqibeleleyo nemfuno iyonke yeetshiphusi ezininzi ngaphakathi. Ngokwaziswa koMthetho we-US CHIPS, ukhuphiswano lobuchwepheshe beetshiphusi phakathi kweTshayina ne-United States luqine ngakumbi, kwaye kunokubakho ubuninzi bezinto ezifumanekayo. Unyaka ka-2021 ubone ukwehla okukhulu kokungeniswa kweetshiphusi yiTshayina.

Itshiphu ecutshungulwe ngeLaser

I-laser esetyenziswa ekucubunguleni iitships ze-semiconductor

Iiwafers zizinto ezisisiseko zeemveliso ze-semiconductor kunye neetships, ekufuneka zicocwe ngoomatshini emva kokukhula. Kwinqanaba lokugqibela, ukusika iwafer, okwaziwa ngokuba yi-wafer dicing, kubaluleke kakhulu. Itekhnoloji yokuqala yokusika iwafer yelaser ye-DPSS ye-short-pulse iye yaphuhliswa kwaye yavuthwa eYurophu nase-United States. Njengoko amandla ee-laser ze-ultrafast esanda, ukusetyenziswa kwayo kuya kuba yinto eqhelekileyo kwixesha elizayo, ngakumbi kwiinkqubo ezinje ngokusika iwafer, imingxunya yokubhola encinci, uvavanyo lwe-beta oluvaliweyo. Amandla okufunwa kwezixhobo ze-laser ze-ultrafast makhulu kakhulu xa kuthelekiswa.

Ngoku, kukho abavelisi bezixhobo ze-laser ezichanekileyo eTshayina abanokubonelela ngezixhobo ze-wafer slotting, ezinokusetyenziswa kwi-slotting yomphezulu wee-wafers eziyi-12-intshi phantsi kwenkqubo ye-28nm, kunye nezixhobo zokusika ze-laser wafer crypto ezisetyenziswa kwiitships ze-sensor ze-MEMS, iitships zememori kunye nezinye iindawo zokwenza iitships eziphezulu. Ngo-2020, ishishini elikhulu le-laser eShenzhen laphuhlisa izixhobo ze-laser debonding ukuze kufezekiswe ukwahlulwa kweglasi kunye nezilayi ze-silicon, kwaye izixhobo zingasetyenziselwa ukuvelisa iitships ze-semiconductor eziphezulu.

Isitya seChip sokusika iLaser

Phakathi kowama-2022, ishishini le-laser eWuhan laqalisa izixhobo zokusika ezizenzekelayo eziguqulwe nge-laser, ezasetyenziswa ngempumelelo kunyango lomphezulu we-laser kwicandelo leetships. Esi sixhobo sisebenzisa i-laser ye-femtosecond echanekileyo kakhulu kunye namandla aphantsi kakhulu okubetha ukwenza utshintsho lwe-laser kumphezulu wezixhobo ze-semiconductor kuluhlu lwe-micron, ngaloo ndlela siphucula kakhulu ukusebenza kwezixhobo ze-optoelectronic ze-semiconductor. Esi sixhobo sifanelekile kwii-semiconductor ze-compound SiC, GaAs, LiTaO3 kunye nezinye izixhobo zokusika zangaphakathi ze-wafer chip, ezifana neetships ze-silicon, iitships ze-MEMS sensor, iitships ze-CMOS, njl.

I-China ijongene neengxaki zobugcisa eziphambili zoomatshini be-lithography, nto leyo eya kukhuthaza imfuno yee-laser ze-excimer kunye nee-laser ze-ultraviolet ezigqithisileyo ezinxulumene nokusetyenziswa koomatshini be-lithography, kodwa kukho uphando oluncinci kweli candelo ngaphambili e-China.

Iintloko zokucubungula nge-laser ezichanekileyo zeetships eziphezulu kunye neetships zinokuba yingxaki elandelayo

Ngenxa yobuthathaka kwishishini leetshiphusi ze-semiconductor eTshayina ngaphambili, bekukho uphando oluncinci kunye nokusetyenziswa kweetshiphusi zokucubungula i-laser, ezazisetyenziswa okokuqala kwindibano yesiphelo seemveliso ze-elektroniki zabathengi ezisezantsi. Kwixesha elizayo, imakethi ephambili yokucubungula i-laser ngokuchanekileyo eTshayina iya kuhamba kancinci ukusuka ekucutshungulweni kwamacandelo e-elektroniki ngokubanzi ukuya kwizixhobo eziphezulu kunye nezinto eziphambili, ngakumbi ukulungiswa kwezixhobo ze-semiconductor, izinto ze-biomedical, kunye nezixhobo ze-polymer.

Kuza kuphuhliswa iinkqubo ezininzi zokusetyenziswa kwelaser kushishino lweetshiphusi ze-semiconductor. Kwiimveliso zeetshiphusi ezichanekileyo kakhulu, ukucubungula okungabonakaliyo kwe-optical yeyona ndlela ifanelekileyo. Ngenxa yemfuno enkulu yeetshiphusi, ishishini leetshiphusi linokuba negalelo kumjikelo olandelayo wemfuno yezixhobo zokucubungula ilaser ezichanekileyo.