Uphi Umjikelezo Olandelayo Wokukhula Ekucutshungulweni Kwe-Laser Okunembile?

Esikhathini esingeside esidlule, i-Apple Inc. imemezele ngokusemthethweni ukukhishwa kwesizukulwane esisha se-iPhone 14, igcina umkhuba wokuvuselela okukodwa ngonyaka. Abasebenzisi abaningi bayashaqeka ukuthi "i-iPhone isithuthuke yaze yaba yisizukulwane se-14". Futhi ngokushesha yawina ukubhukha okungaphezu kwesigidi esisodwa emakethe yaseShayina. I-iPhone isathandwa kakhulu yintsha.

Ama-Smartphone aqala umjikelezo wokuqala wesidingo sokucutshungulwa kwe-laser ngokunemba

Eminyakeni engaphezu kweshumi edlule, lapho ama-smartphone esanda kwethulwa, ubuchwepheshe bokucubungula i-laser yezimboni babusasezingeni eliphansi. I-laser ye-fibre kanye ne-laser ye-ultrafast kwakuyizinto ezintsha futhi zingenalutho emakethe yaseShayina, ingasaphathwa eyokucubungula i-laser ngokunemba. Kusukela ngo-2011, ukumakwa kwe-laser ngokunemba okuphansi kuye kwasetshenziswa kancane kancane eShayina. Ngaleso sikhathi, kwaxoxwa nge-laser eluhlaza enamandla amancane kanye ne-laser ye-ultraviolet. Manje, i-laser ye-ultrafast iye yasetshenziswa kancane kancane ngezinjongo zezentengiselwano, futhi kukhulunywa ngokucutshungulwa kwe-laser ngokunemba kwe-ultrafast.

Ukusetshenziswa okukhulu kokucubungula i-laser ngokunemba kuqhutshwa kakhulu yintuthuko yama-smartphone. Ukukhiqizwa kwama-slide ekhamera, amamojula eminwe, okhiye be-HOME, izimbobo zekhamera ezingaboni, kanye namaphaneli efoni anqunywa ngesimo esingajwayelekile, njll., konke kuyazuza ekuthuthukisweni kobuchwepheshe bokusika ngokunemba kwe-laser nge-ultrafast. Ibhizinisi lokucubungula ngokunemba labakhiqizi abakhulu bokucubungula i-laser ngesineke baseShayina livela kuma-electronics abathengi. Okusho ukuthi, umjikelezo wokugcina wokukhula kokucubungula i-laser ngokunemba uqhutshwa ama-electronics abathengi, ikakhulukazi ama-smartphone namaphaneli okubonisa.

Ukusikwa Kwephaneli Ye-Laser

Kusukela ngo-2021, imikhiqizo yabathengi efana nama-smartphone, amabhande esandla agqokwayo kanye namaphaneli okubonisa abonise ukuthambekela kokwehla, okuholela ekufuneni okubuthakathaka kwemishini yokucubungula ama-elekthronikhi yabathengi kanye nengcindezi enkulu ekukhuleni kwayo. Ngakho-ke ingabe i-iPhone14 entsha ingaqalisa umjikelezo omusha wokukhula kokucubungula? Kodwa uma sibheka ukuthambekela kwamanje kokuthi abantu abazimisele kangako ukuthenga ifoni entsha, cishe kuqinisekile ukuthi ama-smartphone awakwazi ukufaka isandla ekukhuleni okusha kwesidingo semakethe. I-5G kanye namafoni agoqekayo adumile eminyakeni embalwa edlule angaletha nje ukushintshwa kwesitoko okuyingxenye. Ngakho-ke, umjikelezo olandelayo wokwanda kwesidingo ekucutshungulweni kwe-laser ngokunemba ungaba kuphi?

Ukukhula kwemboni ye-semiconductor kanye ne-chip yaseShayina

IShayina iyifektri yomhlaba wonke eyiqiniso. Ngo-2020, inani elengeziwe lemboni yokukhiqiza yaseShayina libalelwa ku-28.5% wesabelo somhlaba. Yimboni yokukhiqiza enkulu yaseShayina eletha amathuba amakhulu emakethe yokucubungula nokukhiqiza nge-laser. Kodwa-ke, imboni yokukhiqiza yaseShayina inokuqoqana okubuthakathaka kobuchwepheshe esigabeni sokuqala, futhi iningi lazo yizimboni eziphakathi nendawo neziphansi. Ishumi leminyaka elidlule libone intuthuko enkulu kwemishini, ezokuthutha, amandla, ubunjiniyela basolwandle, izindiza, imishini yokukhiqiza, njll., okuhlanganisa ukuthuthukiswa kwama-laser nemishini ye-laser, okunciphise kakhulu igebe nezinga elithuthukile lomhlaba wonke.

Ngokwezibalo ezivela kwi-Semiconductor Industry Association, i-China enkulu iyona eyakha i-fab esheshayo emhlabeni, ene-fab ezinkulu ezingu-31 ezigxile enqubweni yokuvuthwa okulindeleke ukuthi ziqedwe ekupheleni kuka-2024; Ijubane selidlule kakhulu i-fab ezingu-19 ezihlelelwe ukusebenza eTaiwan, eChina phakathi nenkathi efanayo, kanye ne-fab ezingu-12 ezilindelekile e-United States.

Esikhathini esingeside esidlule, iShayina yamemezela ukuthi imboni yesekethe ehlanganisiwe yaseShanghai idlule enqubweni ye-chip engu-14nm futhi yafinyelela isikali esithile sokukhiqiza ngobuningi. Kwamanye ama-chip angaphezu kuka-28nm asetshenziswa ezintweni zasekhaya, ezimotweni nasezokuxhumana, iShayina izigqaja ngokwedlula inqubo yokukhiqiza evuthiwe, futhi ingahlangabezana ngokuphelele nesidingo esiphelele sama-chip amaningi ngaphakathi. Ngokwethulwa koMthetho we-US CHIPS, umncintiswano wobuchwepheshe be-chip phakathi kweShayina ne-United States uqine kakhulu, futhi kungase kube nokunikezwa okuningi. Unyaka ka-2021 wabona ukwehla okukhulu kokungeniswa kwama-chip yiShayina.

I-Chip Ecutshungulwe Nge-Laser

I-laser esetshenziswa ekucubungulweni kwama-chips e-semiconductor

Ama-wafer ayizinto eziyisisekelo zemikhiqizo ye-semiconductor nama-chips, okudingeka acwebezelwe ngomshini ngemva kokukhula. Esigabeni sokugcina, ukusika i-wafer, okwaziwa nangokuthi i-wafer dicing, kubaluleke kakhulu. Ubuchwepheshe bokuqala bokusika i-wafer ye-laser ye-DPSS ye-short-pulse buthuthukisiwe futhi bavuthwa eYurophu nase-United States. Njengoba amandla ama-laser e-ultrafast ekhula, ukusetshenziswa kwawo kuzoba yinto evamile kancane kancane esikhathini esizayo, ikakhulukazi ezinqubweni ezifana nokusika i-wafer, imigodi emincane yokubhoboza, ukuhlolwa kwe-beta okuvaliwe. Amandla okufunwa kwemishini ye-laser ye-ultrafast makhulu kakhulu uma kuqhathaniswa.

Manje, kukhona abakhiqizi bemishini ye-laser enembile eShayina abangahlinzeka ngemishini yokusika i-wafer, engasetshenziswa ekufakweni kwe-wafers engu-12-intshi ngaphansi kwenqubo engu-28nm, kanye nemishini yokusika i-crypto ye-laser wafer esetshenziswa kuma-chip enzwa ye-MEMS, ama-memory chips kanye neminye imikhakha yokukhiqiza ama-chip aphezulu. Ngo-2020, inkampani enkulu ye-laser eShenzhen yathuthukisa imishini yokususa i-laser ukuze kuhlukaniswe izingcezu zengilazi ne-silicon, futhi imishini ingasetshenziswa ukukhiqiza ama-chip e-semiconductor aphezulu.

I-Laser Cutting Chip Wafer

Maphakathi no-2022, ibhizinisi le-laser eWuhan laqala imishini yokusika eguqulwe nge-laser esebenza ngokuzenzakalelayo, eyasetshenziswa ngempumelelo ekwelashweni kobuso be-laser emkhakheni wama-chips. Le divayisi isebenzisa i-laser ye-femtosecond enembile kakhulu kanye namandla okushaya aphansi kakhulu ukwenza ukuguqulwa kwe-laser ebusweni bezinto ze-semiconductor kububanzi be-micron, ngaleyo ndlela ithuthukisa kakhulu ukusebenza kwamadivayisi e-optoelectronic e-semiconductor. Le mishini ifanelekela ukusika kwe-SiC, i-GaAs, i-LiTaO3 kanye nokunye ukusika kwangaphakathi kwe-wafer chip okubiza kakhulu, okufana nama-silicon chip, ama-MEMS sensor chips, ama-CMOS chips, njll.

IShayina ibhekana nezinkinga zobuchwepheshe ezibalulekile zemishini ye-lithography, okuzoqhuba isidingo sama-laser e-excimer kanye nama-laser e-ultraviolet aqatha ahlobene nokusetshenziswa kwemishini ye-lithography, kodwa kukhona ucwaningo oluncane kulo mkhakha ngaphambili eShayina.

Amakhanda okucubungula nge-laser anembile aphezulu kanye nama-chips angase abe yigagasi elilandelayo lokuthanda izinto ezintsha

Ngenxa yobuthakathaka embonini yama-chip e-semiconductor yaseShayina ngaphambili, bekukhona ucwaningo oluncane kanye nezicelo kuma-chip okucubungula i-laser, aqale asetshenziswa ekuhlanganisweni kwemikhiqizo ye-elekthronikhi yabathengi engezansi. Esikhathini esizayo, imakethe eyinhloko yokucubungula i-laser ngokunemba eShayina izoshintsha kancane kancane isuke ekucutshungulweni kwezingxenye ze-elekthronikhi ezijwayelekile iye ezintweni ezisezingeni eliphezulu kanye nezingxenye ezibalulekile, ikakhulukazi ukulungiswa kwezinto ze-semiconductor, izinto ze-biomedical, kanye ne-polymer.

Kuzothuthukiswa izinqubo eziningi zokusebenzisa i-laser embonini yama-chip e-semiconductor. Ngemikhiqizo yama-chip enembile kakhulu, ukucubungula okungabonakali kuyindlela efanele kakhulu. Njengoba kunesidingo esikhulu sama-chip, imboni yama-chip cishe izofaka isandla emzuliswaneni olandelayo wesidingo semishini yokucubungula i-laser enembile.