Uphi Umjikelezo Olandelayo We-Boom In Precision Laser Processing?

Kungekudala, i-Apple Inc. yamemezela ngokusemthethweni ukukhululwa kwesizukulwane esisha se-iPhone 14, egcina umkhuba wokuvuselela okukodwa ngonyaka. Abasebenzisi abaningi bashaqekile ngokuthi "i-iPhone ithuthukiswe isizukulwane se-14". Futhi iwine ngokushesha ukubhukha oku-inthanethi okungaphezu kwesigidi esi-1 emakethe yaseShayina. I-iPhone isathandwa ngabantu abasha.

Ama-Smartphones aqala umzuliswano wokuqala wesidingo sokucutshungulwa kwe-laser okunembayo
Eminyakeni engaphezu kweshumi edlule, lapho ama-smartphones esanda kwethulwa, ubuchwepheshe bokucubungula i-laser yezimboni babusesezingeni eliphansi. I-fiber laser kanye ne-ultrafast laser kwakuyizinto ezintsha futhi ezingenalutho emakethe yaseShayina, ngingasho ukucutshungulwa kwe-laser okunembayo. Kusukela ngo-2011, ukumakwa kwe-laser okunembayo okusezingeni eliphansi kuye kwasetshenziswa kancane kancane eShayina. Ngaleso sikhathi, kwaxoxwa nge-laser eluhlaza okwesibhakabhaka enamandla amancane ne-ultraviolet laser. Futhi manje, i-ultrafast laser kancane kancane isetshenziselwa izinjongo zokuthengisa, futhi ukucubungula kwe-laser enembe kakhulu kukhulunywa ngakho.

Ukusetshenziswa kwenqwaba yokucubungula kwe-laser okunembayo kuqhutshwa kakhulu ukuthuthukiswa kwe-smartphone. Ukukhiqizwa kwamaslayidi ekhamera, amamojula wezigxivizo zeminwe, okhiye be-HOME, izimbobo eziyimpumputhe zekhamera, nokusika amaphaneli omakhalekhukhwini anomumo ongajwayelekile, njll., konke kuyazuza ekuthuthukisweni kobuchwepheshe bokusika ukunemba kwe-laser okusheshayo. Ibhizinisi lokucubungula ukunemba labakhiqizi abakhulu baseShayina abalungisa ukunemba kwe-laser livela ku-electronics abathengi. Okusho ukuthi, umjikelezo wokugcina we-boom ekucutshungulweni kwe-laser ukunemba unikwa amandla ama-electronics abathengi, ikakhulukazi ama-smartphone namaphaneli wokubonisa.

I-Laser Panel Cutting

Kusukela ngo-2021, imikhiqizo yabathengi efana nama-smartphones, amabhande esandla agqokekayo namaphaneli abonisiwe akhombise ukwehla, okuholela esidingweni esibuthakathaka semishini yokucubungula ugesi wabathengi kanye nengcindezi enkulu ekukhuleni kwayo. Ngakho-ke ingabe i-iPhone14 entsha ingaqala umjikelezo omusha wokucubungula i-boom? Kodwa uma sibheka indlela yamanje yokuthi abantu abazimisele kangako ukuthenga ifoni entsha, cishe kuqinisekile ukuthi ama-smartphones awakwazi ukufaka isandla ekukhuleni okusha kwesidingo semakethe. I-5G nezingcingo ezigoqekayo ezazidumile eminyakeni embalwa edlule zingavele zilethe ukushintshwa kwesitoko ngokwengxenye.Ngakho-ke, lapho umzuliswano olandelayo wokwanda kwesidingo ekucutshungulweni kwe-laser ungaba kuphi?

Ukukhula kwemboni ye-semiconductor kanye ne-chip yase-china

I-China iyimboni yomhlaba eyiqiniso. Ngo-2020, inani elengeziwe lemboni yokukhiqiza yaseShayina libalelwa ku-28.5% wamasheya omhlaba. Kuyimboni enkulu yaseShayina yokukhiqiza eletha amandla amakhulu emakethe okucubungula nokukhiqiza i-laser. Kodwa-ke, imboni yokukhiqiza yaseShayina inokuqoqwa kwezobuchwepheshe okubuthakathaka ekuqaleni, futhi iningi lazo izimboni ezimaphakathi neziphansi. Iminyaka eyishumi edlule ibone inqubekelaphambili enkulu emishinini, ezokuthutha, amandla, ubunjiniyela basolwandle, i-aerospace, imishini yokukhiqiza, njll., okuhlanganisa nokuthuthukiswa kwama-lasers kanye nemishini ye-laser, okuye kwanciphisa kakhulu igebe ngezinga elithuthukisiwe lamazwe ngamazwe.

Ngokwezibalo ezivela ku-Semiconductor Industry Association, izwe laseShayina lingumkhiqizi wendwangu oshesha ukudlula wonke emhlabeni, elinezindwangu ezinkulu ezingu-31 ezigxile enqubweni evuthiwe okulindeleke ukuba iqedwe ekupheleni kuka-2024; Ijubane lidlule kakhulu izindwangu eziyi-19 ezihlelelwe ukusebenza eTaiwan, eChina ngesikhathi esifanayo, kanye nezindwangu eziyi-12 ezilindelwe e-United States.

Esikhathini esingeside esidlule, i-China yamemezela ukuthi imboni yesekethe ehlanganisiwe yase-Shanghai yephule inqubo ye-chip ye-14nm futhi yazuza isikali esithile sokukhiqiza ngobuningi. Kwamanye ama-chips angaphezu kuka-28nm asetshenziswa ezintweni zasendlini, ezimotweni kanye nezokuxhumana, i-China iziqhayisa ngenqubo yokukhiqiza evuthiwe, futhi ingahlangabezana ngokuphelele nesidingo esiphelele sama-chips amaningi ngaphakathi. Ngokwethulwa koMthetho we-U.S. CHIPS, umncintiswano wobuchwepheshe be-chip phakathi kwe-China ne-United States ushube kakhulu, futhi kungase kube nensada yokuhlinzeka. 2021  sibone ukwehla okukhulu ekuthengisweni kwe-chips eChina.

I-Laser Processed Chip

I-laser esetshenziswa ekucubunguleni ama-semiconductor chips

Ama-wafers ayizinto eziyisisekelo zemikhiqizo ye-semiconductor nama-chips, adinga ukupholishwa ngomshini ngemva kokukhula. Esigabeni sakamuva, ukusika i-wafer, okubuye kwaziwe ngokuthi yi-wafer dicing, kubaluleke kakhulu. Ubuchwepheshe bokusika i-laser wafer ye-DPSS ye- short-pulse short-pulse sebuthuthukisiwe futhi bavuthwa e-Europe nase-United States. Njengoba amandla ama-laser asheshayo enyuka, ukusetshenziswa kwawo kancane kancane kuzoba okujwayelekile esikhathini esizayo, ikakhulukazi ezinqubweni ezinjengokusikwa kwe-wafer, izimbobo zokubhoboza ezincane, ukuhlolwa kwe-beta evaliwe. Amandla esidingo semishini ye-laser esheshayo makhulu ngokuqhathaniswa.

Manje, kukhona abakhiqizi bemishini ye-laser enembayo e-China abangahlinzeka ngemishini yokufaka i-wafer slotting, engasetshenziswa endaweni yokubeka ama-wafers angama-intshi angu-12 ngaphansi kwenqubo engu-28nm, kanye nemishini yokusika ye-laser wafer crypto esetshenziswa kuma-chips sensor we-MEMS, ama-memory chips nokunye. imikhakha ephezulu yokukhiqiza ama-chip. Ngo-2020, inkampani enkulu ye-laser e-Shenzhen yathuthukisa imishini yokukhipha i-laser ukuze ibone ukuhlukaniswa kwezingcezu zengilazi ne-silicon, futhi okokusebenza kungasetshenziswa ukukhiqiza ama-chips asezingeni eliphezulu.

I-Laser Cutting Chip Wafer

Maphakathi no-2022, inkampani ye-laser e-Wuhan yakhipha imishini yokusika eshintshwa nge-laser ezenzakalelayo, eyasetshenziswa ngempumelelo ekwelashweni kwe-laser emkhakheni wama-chips. Idivayisi isebenzisa i-laser ye-femtosecond enembayo ephezulu kanye namandla okushaya kwenhliziyo aphansi kakhulu ukwenza ukuguqulwa kwe-laser ebusweni bezinto ezisetshenziswayo ze-semiconductor ebangeni le-micron, ngaleyo ndlela ithuthukise kakhulu ukusebenza kwamadivayisi e-semiconductor optoelectronic. Izisetshenziswa zifanele izindleko eziphezulu, isiteshi esincane (≥20um) semiconductor ehlanganisiwe ye-SiC, i-GaAs, i-LiTaO3 nokunye ukusika ukuguqulwa kwangaphakathi kwe-wafer chip, njengama-silicon chips, ama-sensor chips e-MEMS, ama-CMOS chips, njll. 

I-China ibhekana nezinkinga ezibalulekile zobuchwepheshe zemishini ye-lithography, ezoqhuba isidingo samalaser e-excimer namalaser e-ultraviolet ngokweqile ahlobene nokusetshenziswa kwemishini ye-lithography, kodwa luncane ucwaningo kulo mkhakha ngaphambili e-China.

Amakhanda okucubungula i-laser anembile ukuze uthole isiphetho esiphezulu nama-chips angase abe igagasi elilandelayo lokuhlanya

Ngenxa yobuthakathaka embonini ye-chip ye-semiconductor yaseShayina ngaphambili, kube nocwaningo oluncane kanye nezicelo kuma-chips okucubungula i-laser, aqale asetshenziswa ekuhlanganisweni kwetheminali yemikhiqizo ye-elekthronikhi ethengwayo esezingeni eliphansi. Ngokuzayo, imakethe enkulu yokucutshungulwa kwe-laser ngokunemba e-China izosuka kancane kancane ekucutshungulweni kwezingxenye ezijwayelekile ze-elekthronikhi iye ezintweni ezikhuphuka nomfula kanye nezingxenye ezibalulekile, ikakhulukazi ukulungiswa kwezinto zokwakha ze-semiconductor, i-biomedical, kanye ne-polymer materials.

Kuzothuthukiswa izinqubo zokusetshenziswa kwe-laser embonini ye-semiconductor chip. Ngemikhiqizo ye-chip enembayo ephezulu, ukucutshungulwa kwe-optical okungaxhunywanga kuyindlela efanelekile kakhulu. Ngesidingo esikhulu sama-chips, imboni yama-chip kungenzeka ibambe iqhaza emzuliswaneni olandelayo wesidingo semishini yokucubungula i-laser enembayo.

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