Through-Glass Via (TGV) technology has emerged as a pivotal advancement in modern electronics and the semiconductor industry. The predominant method for fabricating these vias is laser-induced etching, which employs femtosecond lasers to create a degenerated region in the glass via ultrafast pulses. This precise etching process allows for the creation of high-aspect-ratio vias essential for advanced electronic applications.
To ensure the optimal performance of ultrafast lasers used in this etching process, maintaining precise temperature control is crucial. TEYU Laser Chiller CWUP-20ANP stands out in this regard, offering a high-temperature stability of ±0.08℃, enhancing the reliability of the laser-induced etching process. By effectively managing thermal conditions, high-precision laser chiller CWUP-20ANP contributes to the consistent production of high-quality TGVs, driving advances in modern electronic devices.
