Lisebelisoa tsa semiconductor li rata chip le boto e kopantsoeng ea potoloho ke senotlolo sa ho nts'etsapele thekenoloji ea 5G, li-micro-electronics, puisano e potlakileng, koloi e bohlale, ho etsa lihlahisoa tse phahameng joalo-joalo. E amana haufi-ufi le tsoelopele ea naha. Ka hona, nakong e tlang e tlang, tlhoko ea thepa ea semiconductor e tla tsoela pele ho hola. Ho fihlela tlhokahalo ea tlhahiso, lisebelisoa tsa ts'ebetso ea semiconductor li tla ba le kholo e kholo. Lisebelisoa tsena li kenyelletsa stepper, mochini oa laser etching, lisebelisoa tse tšesaane tsa filimi, mochini oa ion, mochini oa laser scribing, mochini oa ho phunya lesoba la laser joalo-joalo.
Joalo ka se ka bonoang kaholimo, boholo ba mochini o sebetsang oa semiconductor o tšehetsoa ke mokhoa oa laser. Lebone la lebone la laser le ka ba le phello e ikhethang ho sebetsa thepa ea semiconductor ka lebaka la ho se kopane, ho sebetsa hantle haholo le boleng bo nepahetseng.
Mesebetsi e mengata ea ho itšeha ka silicon e ne e sebelisoa ka ho itšeha ka mochini. Empa joale, ho itšeha ka laser ho nka qoso. Mokhoa oa laser o na le ts'ebetso e phahameng haholo, mokhoa o bonolo oa ho itšeha, 'me ha ho na tlhoko ea ho tsoela pele ka mor'a ts'ebetso le ntle le ho hlahisa litšila. Nakong e fetileng, laser wafer cuting e ne e sebelisoa nanosecond UV laser, kaha laser ea UV e tšoauoa ka libaka tse nyane tse amang mocheso mme e tsejoa e le ts'ebetso e batang. Empa lilemong tsa morao tjena ka ntlafatso ea lisebelisoa, laser ea ultrafast, haholo-holo picosecond laser e 'nile ea sebelisoa butle-butle ho seha ka laser. Ka matla a laser ea ultrafast e ntse e eketseha, ho lebelletsoe hore laser ea picosecond UV esita le femtosecond UV laser e tla sebelisoa haholo ho fihlela ts'ebetso e nepahetseng le e potlakileng.
Haufinyane, indasteri ea semiconductor naheng ea rona e tla kena nakong e holang ka potlako, e tlisa tlhokahalo e kholo ea lisebelisoa tsa semiconductor le palo e kholo ea ts'ebetso ea li-wafer. Tsena kaofela li thusa ho khothaletsa tlhokahalo ea laser micro-machining, haholo laser e potlakileng haholo.
Semiconductor, touch screen, moreki likarolo tsa elektronike e tla ba lisebelisoa tsa bohlokoa ka ho fetisisa tsa ultrafast laser. Hajoale, laser ea lapeng ea ultrafast e ntse e hola ka potlako mme theko ea theoha. Mohlala, bakeng sa laser ea 20W picosecond, theko ea eona e fokotseha ho tloha ho RMB ea pele ea 1 milione ho ea ho tlase ho 400,000 RMB. Ena ke mokhoa o motle bakeng sa indasteri ea semiconductor.
Ho tsitsa ha lisebelisoa tsa ultrafast ho amana haufi-ufi le tsamaiso ea mocheso. Selemong se fetileng, S&A Teyu o ile a qala lenaneo lae nkehang habobebe indasteri chiller unit CWUP-20 e ka sebelisoang ho pholisa femtosecond laser, laser picosecond, laser nanosecond le lasers tse ling tsa ultrafast. Fumana ho eketsehileng ka chiller ena hohttps://www.teyuchiller.com/portable-water-chiller-cwup-20-for-ultrafast-laser-and-uv-laser_ul5
