Ukuhlangabezana nesidingo sokukhiqiza, imishini yokucubungula i-semiconductor izokhula ngendlela emangalisayo. Le mishini ihlanganisa isitebhisi, umshini wokufaka i-laser etching, okokusebenza kwefilimu encane, i-ion implantation, umshini wokubhala nge-laser, umshini wokumba imbobo ye-laser nokunye.
Njengoba kungabonwa ngenhla, iningi lomshini wokucubungula impahla ye-semiconductor lisekelwa inqubo ye-laser. I-Laser light beam ingaba nomthelela oyingqayizivele ekucubunguleni okubalulekile kwe-semiconductor ngenxa yokungathintani kwayo, ikhwalithi esebenza kahle kakhulu nenembayo.
Imisebenzi eminingi yokusika i-wafer esekwe ku-silicon yayisetshenziswa ngokusika ngomshini. Kodwa manje, ukunemba kwe-laser cutting kuthatha icala. Indlela ye-Laser ifaka ukusebenza kahle okuphezulu, unqenqema lokusika olubushelelezi futhi asikho isidingo sokuqhubeka nokucubungula futhi ngaphandle kokukhiqiza noma yikuphi ukungcola. Esikhathini esedlule, ukusika kwe-laser wafer kwakusetshenziswa i-nanosecond UV laser, njengoba i-UV laser ibonakala ngokushisa okuncane okuthinta indawo futhi yaziwa ngokuthi ukucubungula okubandayo. Kodwa eminyakeni yamuva nje ngokuvuselelwa kwemishini, i-laser ye-ultrafast, ikakhulukazi i-picosecond laser iye yasetshenziswa kancane kancane ekusikeni kwe-wafer laser. Ngamandla e-laser esheshayo eqhubeka nokukhula, kulindeleke ukuthi i-picosecond UV laser kanye ne-femtosecond UV laser izosetshenziswa kabanzi ukuze kuzuzwe ukucutshungulwa okunembe kakhudlwana nokushesha.
Esikhathini esizayo esiseduze, imboni ye-semiconductor ezweni lethu izongena esikhathini esikhula ngokushesha, ilethe isidingo esikhulu semishini ye-semiconductor kanye nenani elikhulu lokucutshungulwa kwe-wafer. Konke lokhu kusiza ukukhuthaza isidingo se-laser micro-machining, ikakhulukazi i-laser esheshayo.
I-semiconductor, isikrini sokuthinta, ukukhiqizwa kwezingxenye ze-electronics zabathengi kuzoba izinhlelo zokusebenza ezibaluleke kakhulu ze-laser esheshayo. Okwamanje, i-laser yasekhaya ye-ultrafast ikhula ngokushesha futhi intengo iyehla. Isibonelo, nge-laser picosecond engu-20W, intengo yayo yehla ukusuka ku-RMB eyisigidi sokuqala ukuya ngaphansi kuka-400,000 RMB. Lona umkhuba omuhle embonini ye-semiconductor.
Ukuzinza kwemishini yokucubungula ye-ultrafast kuhlobene eduze nokuphathwa kokushisa. Ngonyaka odlule, uS&UTeyu wethula uhlelo iyunithi ephathekayo ye-industrial chiller I-CWUP-20 engasetshenziswa ukupholisa i-laser ye-femtosecond, i-picosecond laser, i-nanosecond laser namanye ama-laser asheshayo. Thola kabanzi mayelana nalokhu kupholisa ku https://www.teyuchiller.com/portable-water-chiller-cwup-20-for-ultrafast-laser-and-uv-laser_ul5
