Laser drilling in ceramics of electronics and semiconductor components

Aluminium oxide ceramics and aluminum nitride ceramics feature high heat conduction, high insulation and high temperature resistance, so they have wide applications in electronics and semiconductor areas. However, these ceramics materials are very hard and brittle, so the machine-shaping process is not easy. The micro hole is particularly hard to form. Since laser features high power density and good directivity, it is often used to perform drilling on ceramics. The laser beam is focused on the workpiece through a optical system. The high power density laser light will melt and evaporate the materials and then an air current coming from the laser head will blow away the melted materials and it will form a hole. 

As we know, electronics and semiconductor components have small size and high density, so laser drilling on them is expected to be highly precise and efficient. The common laser source used in laser drilling on ceramics is UV laser. It features very small heat affecting zone and doesn't damage the materials, which makes it the ideal tool to perform drilling on the ceramics materials of the electronics and semiconductor components. 

To maintain the superior effect of UV laser, it is suggested to add an industrial laser chiller. S&A Teyu CWUL-05 laser water chiller is ideal for cooling UV laser from 3W to 5W. It has properly designed pipeline which can avoid the generation of the bubble. In addition, this industrial laser chiller features ±0.2°C temperature stability, so it is doing a good job in controlling the temperature of the UV laser. 

For more information about this chiller, click https://www.teyuchiller.com/compact-recirculating-chiller-cwul-05-for-uv-laser_ul1