Matambudziko eMetallization muSemiconductor Processing uye Magadzirirwo Azvo

Metallization inhanho yakakosha mukugadzirisa semiconductor, inosanganisira kuumbwa kwesimbi inobatana semhangura kana aluminium. Nekudaro, nyaya dzesimbi - kunyanya electromigration uye kuwedzera kupikisa kuramba - zvinounza matambudziko makuru pakuita uye kuvimbika kwemaseketi akabatanidzwa.

Zvinokonzera Metallization Matambudziko

Matambudziko eMetallization anonyanya kukonzereswa nekusajaira tembiricha mamiriro uye microstructural shanduko panguva yekugadzira.:

1. Tembiricha yakanyanyisa: Munguva yekupisa kwepamusoro-tembiricha, simbi inobatana inogona kuona electromigration kana yakawandisa zviyo kukura. Idzi shanduko dze microstructural dzinokanganisa zvinhu zvemagetsi uye kuderedza kuvimbika kwekubatanidza.

2. Kusakwana tembiricha: Kana tembiricha yakadzikira, kupikisa kwekuonana pakati pesimbi nesilicon hakugone kugadziridzwa, zvichikonzera kutapurirana kwazvino, kuwedzera simba rekushandisa, uye kusagadzikana kwehurongwa.

Impact paChip Performance

Izvo zvakasanganiswa mhedzisiro ye electromigration, kukura kwezviyo, uye nekuwedzera kuonana kuramba kunogona kukanganisa zvakanyanya chip performance. Zviratidzo zvinosanganisira kunonoka kutapurirana chiratidzo, zvikanganiso zvepfungwa, uye njodzi yakanyanya yekutadza kushanda. Izvi zvinopedzisira zvakonzera kuwedzera kwemitengo yekugadzirisa uye kuderedzwa kwehupenyu hwechigadzirwa.

Mhinduro dzeMetallization Matambudziko

1. Temperature Control Optimization: Kuita chaiyo thermal manejimendi, sekushandisa maindasitiri-giredhi mvura chillers , inobatsira kuchengetedza kuenderana kwemaitiro tembiricha. Kutonhora kwakadzikama kunoderedza njodzi yekufambiswa kwemagetsi uye inokwidziridza simbi-silicon yekubata kuramba, inosimudzira chip performance uye kuvimbika.

2. Kuvandudza Maitiro: Kugadzirisa zvinhu, ukobvu, uye nzira dzekuisa dzeiyo yekubata layer inogona kubatsira kuderedza kubata kuramba. Matekiniki akadai seakawanda magadzirirwo kana doping ane chaiwo maelement anovandudza kuyerera kwazvino uye kugadzikana.

3. Kusarudzwa kwezvinhu: Kushandisa simbi dzine kukwirira kwemagetsi kusimuka, senge alloys yemhangura, uye yakanyanya conductive yekubata zvinhu senge doped polysilicon kana simbi silicides, inogona kuwedzera kudzikisira kubata kuramba uye kuve nechokwadi chekushanda kwenguva refu.

Mhedziso

Metallization nyaya mu semiconductor kugadzirisa inogona kudzikiswa zvine mutsindo kuburikidza nepamusoro tembiricha yekudzora, yakagadziridzwa yekugadzira yekugadzira, uye sarudzo yemhando yezvinhu. Mhinduro idzi dzakakosha pakuchengetedza chip performance, kuwedzera hupenyu hwechigadzirwa, uye kuve nechokwadi chekuvimbika kwemidziyo yesemiconductor.