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Izinkinga ze-Metallization ku-Semiconductor Processing kanye nokuthi Zizixazululwa Kanjani

Izinkinga ze-Metallization ekucubungulweni kwe-semiconductor, njengokuhamba kwe-electromigration kanye nokwanda kokumelana nokuxhumana, kungehlisa ukusebenza kwe-chip nokuthembeka. Lezi zinkinga zibangelwa kakhulu ukushintsha kwezinga lokushisa kanye nezinguquko ze-microstructural. Izixazululo zihlanganisa ukulawulwa kwezinga lokushisa okunembile kusetshenziswa ama-chiller embonini, izinqubo ezithuthukisiwe zokuxhumana, kanye nokusetshenziswa kwezinto ezithuthukisiwe.

I-Metallization iyisinyathelo esibalulekile ekucutshungulweni kwe-semiconductor, okubandakanya ukwakheka kwezixhumi zensimbi njengethusi noma i-aluminium. Kodwa-ke, izinkinga ze-metallization-ikakhulukazi i-electromigration kanye nokwanda kokumelana nokuxhumana-kubangela izinselele ezinkulu ekusebenzeni nokuthembeka kwamasekhethi ahlanganisiwe.

Izimbangela Zezinkinga Ze-Metallization

Izinkinga ze-Metallization zibangelwa ikakhulukazi izimo zokushisa ezingavamile kanye nezinguquko ze-microstructural ngesikhathi sokwenziwa.:

1. Izinga lokushisa elidlulele: Phakathi ne-annealing yezinga lokushisa eliphezulu, ukuxhunywa kwensimbi kungase kube ne-electromigration noma ukukhula okusanhlamvu okudlulele. Lezi zinguquko ze-microstructural ziphazamisa izakhiwo zikagesi futhi zinciphisa ukwethembeka kokuxhuma.

2. Izinga lokushisa elinganele: Uma izinga lokushisa liphansi kakhulu, ukumelana nokuxhumana phakathi kwensimbi ne-silicon akukwazi ukwenziwa ngcono, okuholela ekudluliselweni okubi kwamanje, ukusetshenziswa kwamandla okwandayo, kanye nokungazinzi kwesistimu.

Umthelela Ekusebenzeni Kwe-Chip

Imiphumela ehlanganisiwe yokufuduka kwe-electromigration, ukukhula okusanhlamvu, nokwanda kokumelana nokuxhumana kungathunaza kakhulu ukusebenza kwe-chip. Izimpawu zifaka phakathi ukudluliswa kwesignali okuhamba kancane, amaphutha engqondo, kanye nengozi ephezulu yokwehluleka ukusebenza. Lokhu ekugcineni kuphumela ekwenyukeni kwezindleko zokunakekela kanye nokuncipha kwemijikelezo yokuphila komkhiqizo.

Metallization Issues in Semiconductor Processing and How to Solve Them

Izixazululo zezinkinga ze-Metallization

1. Ukuthuthukisa Ukulawula Izinga lokushisa: Ukusebenzisa ukuphathwa kwe-thermal okunembile, njengokusebenzisa ama-chillers amanzi asezingeni lezimboni , isiza ukugcina amazinga okushisa enqubo engaguquki. Ukupholisa okuzinzile kunciphisa ubungozi bokufuduka kwe-electromigration futhi kukhulisa ukumelana nokuxhumana kwe-metal-silicon, kuthuthukisa ukusebenza kwe-chip nokuthembeka.

2. Ukuthuthukiswa Kwenqubo: Ukulungisa izinto, ukujiya, nezindlela zokubeka zesendlalelo sokuxhumana kungasiza ukwehlisa ukumelana nokuxhumana. Amasu afana nezakhiwo zezendlalelo eziningi noma i-doping enezici ezithile athuthukisa ukugeleza kwamanje nokuzinza.

3. Ukukhetha Okubalulekile: Ukusebenzisa izinsimbi ezinokumelana okuphezulu nokufuduka kwe-electromigration, njengama-alloys ethusi, nezinto zokuxhumana ezisebenza kakhulu njenge-polysilicon ene-doped noma izinsimbi zensimbi, kungaqhubeka nokunciphisa ukumelana nokuxhumana nokuqinisekisa ukusebenza kwesikhathi eside.

Isiphetho

Izinkinga ze-metallization ekucubungulweni kwe-semiconductor zingancishiswa ngempumelelo ngokulawulwa kwezinga lokushisa okuthuthukisiwe, ukwenziwa okuthuthukisiwe kokuxhumana, nokukhethwa kwezinto zamasu. Lezi zixazululo zibalulekile ekugcineni ukusebenza kwe-chip, ukunweba ubude besikhathi sokuphila komkhiqizo, kanye nokuqinisekisa ukwethembeka kwamadivayisi we-semiconductor.

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