Imiba ye-Metallization kwi-Semiconductor Processing kunye nendlela yokuSombulula

I-Metallization yinyathelo elibalulekileyo ekuqhutyweni kwe-semiconductor, ebandakanya ukubunjwa koqhagamshelwano lwetsimbi olufana nobhedu okanye i-aluminium. Nangona kunjalo, imiba ye-metallization-ingakumbi i-electromigration kunye nokunyuka kokuxhatshazwa koqhagamshelwano-kubangela imingeni ebalulekileyo ekusebenzeni kunye nokuthembeka kweesekethe ezidibeneyo.

Oonobangela beMiba yeMetallization

Iingxaki ze-Metallization zibangelwa ikakhulu ziimeko zobushushu obungaqhelekanga kunye notshintsho lwe-microstructural ngexesha lokwenziwa.:

1. Ubushushu obugqithisileyo: Ngexesha lobushushu obuphezulu be-annealing, uqhagamshelo lwentsimbi lunokufumana i-electromigration okanye ukukhula okuziinkozo okugqithisileyo. Olu tshintsho lwe-microstructural luphazamisa iimpawu zombane kunye nokunciphisa ukuthembeka koqhagamshelwano.

2. Ubushushu obungonelanga: Ukuba iqondo lokushisa liphantsi kakhulu, ukuchasana koqhagamshelwano phakathi kwesinyithi kunye ne-silicon akukwazi ukulungiswa, okukhokelela ekuhanjisweni okungahambi kakuhle kwangoku, ukunyuka kokusetyenziswa kwamandla, kunye nokungazinzi kwenkqubo.

Impembelelo kwi-Chip Performance

Iziphumo ezidityanisiweyo ze-electromigration, ukukhula okuziinkozo, kunye nokwanda kokuchasana nokunxibelelana kunokunciphisa kakhulu ukusebenza kwe-chip. Iimpawu ziquka ukuhanjiswa komqondiso okucothayo, iimpazamo zengqiqo, kunye nomngcipheko ophezulu wokungaphumeleli kokusebenza. Oku ekugqibeleni kukhokelela ekunyukeni kweendleko zokulondolozwa kunye nokunciphisa imijikelo yobomi bemveliso.

Izisombululo kwiingxaki zeMetallization

1. ULungiselelo lokulawula ubushushu: Ukuphumeza ulawulo oluchanekileyo lwe-thermal, njengokusebenzisa i-industrial-grade water chillers , inceda ukugcina ubushushu benkqubo ehambelanayo. Ukupholisa okuzinzile kunciphisa umngcipheko we-electromigration kunye nokwandisa ukuxhathisa ukudibanisa kwe-metal-silicon, ukuphucula ukusebenza kwe-chip kunye nokuthembeka.

2. Ukuphuculwa kweNkqubo: Ukulungelelanisa izixhobo, ubukhulu, kunye neendlela zokubeka i-contact layer kunokunceda ukunciphisa ukuxhathisa koqhagamshelwano. Ubuchwephesha obufana nezakhiwo ezininzi okanye i-doping enezinto ezithile ziphucula ukuhamba kwangoku kunye nokuzinza.

3. Ukukhethwa kwezinto: Ukusebenzisa iintsimbi ezinokumelana okuphezulu kwi-electromigration, njenge-alloys zethusi, kunye nezixhobo zoqhagamshelwano eziqhuba kakhulu ezifana ne-polysilicon edibeneyo okanye i-silicides yensimbi, kunokunciphisa ngakumbi ukuxhathisa ukudibanisa kunye nokuqinisekisa ukusebenza kwexesha elide.

Ukuqukumbela

Imiba ye-metallization ekusetyenzweni kwe-semiconductor inokuthotywa ngokusebenzayo ngolawulo oluphezulu lobushushu, ukwenziwa koqhagamshelwano olulungisiweyo, kunye nokukhethwa kwezinto ezicwangcisiweyo. Ezi zisombululo zibalulekile ekugcineni ukusebenza kwetshiphu, ukwandisa ubomi bemveliso, kunye nokuqinisekisa ukuthembeka kwezixhobo ze-semiconductor.