Ukukrola kweCryogenic kwenza ukuba izinto ziqhubekeke ngokuchanekileyo nangokulawulekayo

Njengoko imveliso ephucukileyo iqhubeka nokutyhalela phambili ekuchanekeni okuphezulu, ulawulo oluqinileyo lwenkqubo, kunye nokuhambelana okubanzi kwezinto, ubuchwepheshe bokugcaba buyatshintsha ngokufanelekileyo. I-Cryogenic Etching, ngolawulo oluchanekileyo lwamaqondo obushushu egumbi kunye ne-substrate, yenza ukuba ukucutshungulwa okuzinzileyo nokuphindaphindekayo nokuba kukwisikali se-nanometer. Ibe yinkqubo ebalulekileyo ekuvelisweni kwe-semiconductor, ukwenziwa kwezixhobo ze-photonic, ukuveliswa kwe-MEMS, kunye namaqonga ophando lwesayensi.

Yintoni iCryogenic Etching?
Ukugrumba okubangelwa yi-cryogenic yinkqubo yokugrumba esekelwe kwi-plasma eyenziwa kumaqondo obushushu aphantsi kakhulu, aqhele ukuba phakathi kwe--80 °C ukuya kwi--150 °C okanye ngaphantsi. Ngexesha lenkqubo, i-substrate igcinwa kumaqondo obushushu azinzileyo aqinileyo, okuvumela iimveliso zokusabela ukuba zenze umaleko olawulwayo wokuthambisa phezu komphezulu wezinto. Le ndlela iphucula kakhulu ukuchaneka kokugrumba kunye nokulawulwa kwenkqubo.

Iindlela eziphambili ziquka:
* Ukukrola okucinezelweyo ecaleni: Ukungashukumi kakuhle kwecala kuvelisa iiprofayili ezithe nkqo nezithe nkqo.
* Ukuphuculwa kokufana kwempendulo: Amaqondo obushushu aphantsi anciphisa ukuguquguquka kwesantya sempendulo, okuphucula uzinzo lwesakhiwo.
* Umgangatho ophezulu womphezulu: Ukurhabaxa komphezulu okuncitshisiweyo kuxhasa izixhobo ze-elektroniki ezisebenza kakuhle nezinobuthathaka.

Iingenelo eziphambili ze-Cryogenic Etching
1. Ubungakanani boMlinganiselo oPhezulu
Ukugrumba kwe-Cryogenic kwenza ukuba kubekho umlinganiselo ophezulu kakhulu wee-aspect ratios kunye nee-sidewalls ezithe nkqo, nto leyo eyenza ukuba kube yeyona ifanelekileyo kwi-deep silicon etching, ii-microchannels, kunye nezakhiwo ze-MEMS ezintsonkothileyo.

2. Ukungqinelana Okugqwesileyo Kwenkqubo Nokuphindaphindwa Kwayo
Ulawulo lobushushu olujulileyo lwe-cryogenic luzinzisa amazinga e-etch, luxhasa iimeko zokuvelisa ezifuna ukuhambelana okuqinileyo kwebhetshi nganye.

3. Ukuhambelana kwezinto ezibanzi
I-cryogenic etching ifanelekile kwiindidi ezahlukeneyo zezinto, kuquka:
* I-silicon
* IiOkside
* IiNitrides
* Iipolymers ezikhethiweyo
* Izinto ze-Photonic ezifana ne-lithium niobate (LiNbO₃)

4. Umonakalo Oncitshisiweyo Womphezulu
Ukuqhuma kwee-ion ezisezantsi kunciphisa ukwakheka kweziphene, nto leyo eyenza le nkqubo ifaneleke kakuhle kwiinxalenye ze-optical, ii-infrared detectors, kunye ne-high-sensitivity microstructures.

Izinto eziphambili zeNkqubo yokuQokelela iCryogenic
Inkqubo eqhelekileyo yokugrumba i-cryogenic iquka oku kulandelayo:
* Igumbi le-Cryogenic kunye nesigaba se-electrode esipholileyo sokusebenza okuzinzileyo kobushushu obuphantsi kakhulu
* Umthombo weplasma (RF / ICP) ukuvelisa iintlobo ezisabelayo ezinoxinano olukhulu
* Inkqubo yokulawula ubushushu (izixhobo zokupholisa) ukugcina ifestile yenkqubo izinzile
* Inkqubo yokuhambisa igesi, exhasa iigesi ezifana ne-SF₆ kunye ne-O₂
* Inkqubo yokulawula evaliweyo edibanisa ubushushu, uxinzelelo, amandla kunye nokuhamba kwegesi
Phakathi kwezi, ukusebenza kolawulo lobushushu yeyona nto iphambili emisela uzinzo lwenkqubo yexesha elide kunye nokuphindaphinda.

Ulungelelwaniso lobushushu kwiinkqubo zeMicro- kunye neNano-Fabrication
Kwimisebenzi yokusebenza ye-micro- kunye ne-nano-fabrication esebenzayo, iinkqubo ze-cryogenic etching zihlala zisetyenziswa kunye neenkqubo ze-laser micromachining. Izicelo eziqhelekileyo ziquka iglasi ngokusebenzisa ukwakheka, ukwenziwa kwesixhobo se-photonic, kunye nokumakishwa kwe-wafer.

Nangona iinjongo zabo zobushushu zahlukile:
* Ukugrumba okubangelwa yi-cryogenic kufuna ukugcina i-wafer kumaqondo obushushu aphantsi kakhulu
* Iinkqubo zelaser zifuna ukugcina umthombo welaser ngaphakathi kwefestile yokusebenza emxinwa, ekufutshane nobushushu begumbi
Zombini ezi nkqubo zifuna uzinzo olukhethekileyo lobushushu.
Ukuqinisekisa amandla okukhupha i-laser azinzileyo, umgangatho we-beam, kunye nokuhambelana kokucubungula ixesha elide, kusetyenziswa ii-laser water chillers ezichanekileyo kakhulu. Kwizicelo ze-laser ezikhawulezayo, ukuchaneka kokulawula ubushushu be-±0.1 °C okanye ngaphezulu (okufana ne-±0.08 °C) kudla ngokufuneka.

Kwiindawo zoshishino nezophando, ii-chillers zobushushu obungaguqukiyo ezifana ne-TEYU CWUP-20 PRO ultrafast laser chiller , ezinozinzo lobushushu obuyi-±0.08 °C, zibonelela ngolawulo lobushushu oluthembekileyo ngexesha lokusebenza ixesha elide. Kunye neenkqubo zokugrumba ze-cryogenic, ezi chillers ezichanekileyo zenza isakhelo solawulo lobushushu olupheleleyo noludibeneyo lokwenziwa kwe-micro- kunye ne-nano-scale.

Izicelo eziqhelekileyo
* Ukugrumba kwe-Cryogenic kusetyenziswa kakhulu kwi:
* Ukugrumba kwee-ion ezisabelayo ngokunzulu (i-DRIE)
* Ukwenziwa kwesakhiwo se-Photonic chip
* Ukuveliswa kwezixhobo zeMEMS
* Ukulungiswa kwetshaneli ye-Microfluidic
* Izakhiwo ezibonakalayo ezichanekileyo
* Ukwenziwa kwezinto ezincinci kumaqonga ophando
Zonke ezi zicelo zifuna ulawulo oluqinileyo malunga nokuma kwecala, ukugudiswa komphezulu, kunye nokuhambelana kwenkqubo.

Isiphelo
Ukugrumba okune-cryogenic akupheleli nje ekunciphiseni ubushushu. Kumalunga nokufikelela kwiimeko zobushushu ezizinzileyo nezilawulwa ngokunzulu ezivumela inqanaba lokuchaneka kunye nokuhambelana ngaphaya kwemida yeenkqubo zokugrumba eziqhelekileyo. Njengoko ubuchwepheshe be-semiconductor, i-photonic, kunye ne-nanomanufacturing buqhubeka buphucula, ukugrumba okune-cryogenic kuba yinkqubo ebalulekileyo, kwaye iinkqubo zokulawula ubushushu ezithembekileyo zihlala zisisiseko esivumela ukuba isebenze ngokupheleleyo.