Imiba yeMetallization kwi-Semiconductor Processing kunye nendlela yokuzisombulula

Ukwenziwa kwesinyithi linyathelo elibalulekileyo ekucutshungulweni kwe-semiconductor, okubandakanya ukwenziwa kwee-metal interconnects ezifana ne-copper okanye i-aluminium. Nangona kunjalo, imiba yokwenziwa kwesinyithi—ingakumbi ukufuduka kwe-electromigration kunye nokwanda kokumelana noqhagamshelwano—ibangela imingeni ebalulekileyo ekusebenzeni nasekuthembekeni kweesekethe ezidibeneyo.

Izizathu zeengxaki zeMetallization

Iingxaki zokwenziwa kwesinyithi zibangelwa ikakhulu ziimeko zobushushu ezingaqhelekanga kunye notshintsho lwesakhiwo ngexesha lokwenziwa:

1. Ubushushu obugqithisileyo: Ngexesha lokufakelwa kobushushu obuphezulu, uqhagamshelo lwesinyithi lunokuba nokufuduka kwe-electro okanye ukukhula okugqithisileyo kwengqolowa. Olu tshintsho lwesakhiwo se-microstructure luchaphazela iipropati zombane kwaye lunciphise ukuthembeka koqhagamshelo.

2. Ubushushu obunganelanga: Ukuba ubushushu buphantsi kakhulu, ukumelana koqhagamshelwano phakathi kwesinyithi nesilicon akunakulungiswa, nto leyo ekhokelela ekudlulisweni kombane okungekho semgangathweni, ukusetyenziswa kwamandla okwandileyo, kunye nokungazinzi kwenkqubo.

Impembelelo ekusebenzeni kweChip

Iziphumo ezidibeneyo zokufuduka kwe-electromigration, ukukhula kweenkozo, kunye nokwanda kokumelana noqhagamshelwano kunokunciphisa kakhulu ukusebenza kwe-chip. Iimpawu ziquka ukuhanjiswa kwesignali okucothayo, iimpazamo zengqiqo, kunye nomngcipheko ophezulu wokungaphumeleli kokusebenza. Oku ekugqibeleni kukhokelela ekunyukeni kweendleko zokugcinwa kunye nokuncipha kwemijikelo yobomi bemveliso.

Izisombululo kwiingxaki zokwenziwa kwesinyithi

1. Ukuphucula Ulawulo Lobushushu: Ukusebenzisa ulawulo oluchanekileyo lobushushu, njengokusebenzisa ii-water chillers ezikumgangatho ophezulu , kunceda ukugcina ubushushu obuhambelanayo. Ukupholisa okuzinzileyo kunciphisa umngcipheko wokufuduka kwe-electromigration kwaye kuphucula ukumelana noqhagamshelwano lwesinyithi ne-silicon, kuphucula ukusebenza kwe-chip kunye nokuthembeka.

2. Ukuphuculwa kweNkqubo: Ukulungisa izixhobo, ubukhulu, kunye neendlela zokubeka umaleko woqhagamshelwano kunokunceda ukunciphisa ukumelana noqhagamshelwano. Iindlela ezifana nezakhiwo ezininzi okanye ukusebenzisa i-doping ngezinto ezithile ziphucula ukuhamba kombane kunye nozinzo.

3. Ukukhetha Izinto: Ukusebenzisa iintsimbi ezinokumelana okuphezulu ne-electromigration, njengee-alloys zekopolo, kunye nezixhobo zoqhagamshelwano eziqhuba kakuhle ezifana ne-polysilicon eneedope okanye i-silicides zesinyithi, kunokunciphisa ngakumbi ukumelana noqhagamshelwano kwaye kuqinisekise ukusebenza kwexesha elide.

Isiphelo

Iingxaki zokwenziwa kwesinyithi ekucutshungulweni kwee-semiconductor zinokuncitshiswa ngempumelelo ngolawulo lobushushu oluphezulu, ukwenziwa koqhagamshelwano oluphuculweyo, kunye nokukhethwa kwezinto ezicwangcisiweyo. Ezi zisombululo zibalulekile ekugcineni ukusebenza kwee-chip, ukwandisa ubomi bemveliso, kunye nokuqinisekisa ukuthembeka kwezixhobo ze-semiconductor.