Kule mihla, ukwenziwa kwe-laser micro-machining ngocoselelo oluphezulu kubandakanyeka kakhulu kwii-elektroniki zabathengi ezifana neefowuni ezihlakaniphileyo apho isikrini se-OLED sidla ngokunqunyulwa yi-laser micro-machining.
I-Chip idlala indima ebalulekileyo kumashishini akumgangatho ophezulu, njengeefowuni eziphathwayo, ikhompyutha, izixhobo zasekhaya, izixhobo zeGPS, njl. Kwaye isixhobo esiphambili esenza i-chip silawulwa kakhulu ngabavelisi bamanye amazwe.
Iindlela ezimbalwa zokusetyenziswa kwezixhobo ze-semiconductor
I-Stepper yinkqubo yokubonakalisa imaski. Ngokusebenzisa umthombo welaser ukukrola ifilimu yokukhusela umphezulu we-wafer, isekethe iya kwenziwa ngomsebenzi wokugcina idatha. Uninzi lwaba steppers basebenzisa i-excimer laser enokuvelisa i-UV laser beam enzulu. Umenzi we-excimer laser ophambili nophambili i-Cymer wathengwa yi-ASML. Kwaye i-stepper entsha iya kuba yi-EUV stepper enokuphumeza inkqubo engaphantsi kwe-10nm. Kodwa le ndlela ngoku isalawulwa ziinkampani zangaphandle.
Kodwa kulindeleke ukuba iTshayina iqhubele phambili kancinci kancinci ekwenzeni iitshiphusi kwaye kamva ikwazi ukuzivelisela ngokwayo kunye nemveliso enkulu. Iistepper zasekhaya nazo zinokwenzeka kwaye ngelo xesha, imfuno yomthombo welaser ochanekileyo iya kwanda.
Olunye usetyenziso olubanzi lwezixhobo ze-semiconductor yishishini leeseli ze-PV eliyeyona marike yamandla acocekileyo ekhula ngokukhawuleza enezona zinto zibalaseleyo kwihlabathi. Iiseli zelanga zinokwahlulwa zibe yi-crystalline silicon solar cell, ibhetri ye-thin-film kunye nebhetri ye-III-V compound. Phakathi kwezi, iseli yelanga ye-crystalline silicon inesicelo esibanzi. Ngokuchasene nomthombo we-laser, iseli ye-PV sisixhobo esidlulisela ukukhanya kumbane. Izinga lokuguqula i-photoelectric lisemgangathweni wokubonisa ukuba iseli ye-PV ilungile kangakanani. Indlela yokusebenzisa izinto kunye nendlela yokusebenza kweli candelo ibaluleke kakhulu.
Ngokuphathelele ukusika i-silicon wafer, kwasetyenziswa isixhobo sokusika sendabuko, kodwa ngobuchule obuphantsi kunye nokusebenza okuphantsi kunye nemveliso ephantsi. Ngenxa yoko, amazwe amaninzi aseYurophu, uMzantsi Korea, i-United States sele eqalise indlela ye-laser echanekileyo kakhulu kudala. Kwilizwe lethu, amandla ethu okuvelisa iiseli ze-PV afikelele kwisiqingatha sehlabathi. Kwaye kwiminyaka emi-4 edlulileyo, njengoko ishishini le-PV liqhubeka likhula, indlela yokucubungula i-laser iye yasetyenziswa kancinci kancinci. Kule mihla, indlela ye-laser inegalelo kwishishini le-PV ngokwenza ukusika i-wafer, ukubhala i-wafer, kunye nokufaka ibhetri ye-PERC.
Ukusetyenziswa kwesithathu kwe-semiconductor yi-PCB, kuquka i-FPCB. I-PCB, eyona nto iphambili kwaye isisiseko sayo yonke i-elektroniki, isebenzisa inani elikhulu lezixhobo ze-semiconductor. Kwiminyaka embalwa edlulileyo, njengoko ukuchaneka kunye nokuhlanganiswa kwe-PCB kusiba phezulu nangakumbi, i-PCB encinci nencinci iya kuvela. Ngelo xesha, isixhobo sokucubungula kunye nokucubungula uqhagamshelwano lwendabuko kuya kuba nzima ukusiqhelanisa, kodwa indlela ye-laser iya kusetyenziswa ngakumbi nangakumbi.
Ukumakisha nge-laser yeyona ndlela ilula kwi-PCB. Okwangoku, abantu badla ngokusebenzisa i-UV laser ukwenza uphawu phezu kwezinto. Nangona kunjalo, ukubhola nge-laser yeyona ndlela ixhaphakileyo kwi-PCB. Ukubhola nge-laser kunokufikelela kwinqanaba le-micrometer kwaye kunokwenza umngxuma omncinci kakhulu ongenakukwazi ukuwenza ngemela yoomatshini. Ukongeza, ukusika izinto zobhedu kunye nokuwelda okuhlanganisiweyo kwi-PCB nako kunokusebenzisa indlela ye-laser.
Njengoko i-laser ingena kwixesha lokwenziwa kwe-micro-machining, i-S&A Teyu ikhuthaze i-air cooled water chiller echanekileyo kakhulu
Xa sijonga emva uphuhliso lwelaser kwiminyaka embalwa edlulileyo, ilaser inezicelo ezininzi ekusikeni nasekudibaniseni isinyithi. Kodwa kwi-micro-machining echanekileyo kakhulu, imeko iphambene. Esinye sezizathu kukuba ukucutshungulwa kwesinyithi kufana nomatshini onzima. Kodwa i-high professional laser micro-machining ifuna inqanaba eliphezulu lokwenza ngokwezifiso kwaye ijongene nemingeni efana nobunzima bokuphuhlisa le ndlela kunye nexesha elininzi elichithwayo. Kule mihla, i-high professional laser micro-machining ibandakanyeka kakhulu kwi-electronics zabathengi njenge-smart phone apho isikrini se-OLED sihlala sisikwa yi-laser micro-machining.
Kwiminyaka eli-10 ezayo, izinto ze-semiconductor ziya kuba lishishini eliphambili. Ukucutshungulwa kwezinto ze-semiconductor mhlawumbi kungaba sisizathu sophuhliso olukhawulezileyo lwe-laser micro-machining. I-laser micro-machining isetyenziswa kakhulu yi-laser emfutshane okanye emfutshane kakhulu, eyaziwa ngokuba yi-ultrafast laser. Ke ngoko, ngenxa yendlela yokwenziwa kwezinto ze-semiconductor ekhaya, imfuno yokucubungula i-laser ngocoselelo oluphezulu iya kwanda.
Nangona kunjalo, isixhobo selaser esisebenza ngobuchule obuphezulu sinzima kakhulu kwaye kufuneka sixhotyiswe ngesixhobo sokulawula ubushushu obuphezulu ngokulinganayo.
Ukuze kuhlangatyezwane nolindelo lwemarike lwesixhobo se-laser esichanekileyo kakhulu sasekhaya, i-S&A Teyu ikhuthaze i-CWUP series recirculating laser water chiller enozinzo lobushushu olufikelela kwi-±0.1℃ kwaye yenzelwe ngokukodwa ukupholisa ii-ultrafast lasers ezifana ne-femtosecond laser, i-nanosecond laser, i-picosecond laser, njl. Fumana ulwazi oluthe kratya malunga neyunithi ye-CWUP series laser water chiller apha https://www.teyuchiller.com/portable-water-chiller-cwup-20-for-ultrafast-laser-and-uv-laser_ul5
Silapha ngenxa yakho xa usidinga.
Nceda ugcwalise ifomu ukuze uqhagamshelane nathi, kwaye siya kukuvuyela ukukunceda.
