Kulezi zinsuku, ukushintshwa kwe-laser micro-machining okunembe kakhulu kuhileleke kakhulu kuma-electronics asetshenziswa ngabathengi njengefoni ehlakaniphile lapho isikrini sayo se-OLED sivame ukunqunywa yi-laser micro-machining.
I-Chip idlala indima ebalulekile ezimbonini ezisezingeni eliphezulu, njengefoni ehlakaniphile, ikhompyutha, izinto zikagesi zasekhaya, idivayisi ye-GPS, njll. Futhi idivayisi eyinhloko eyenza i-chip ngokuvamile ilawulwa abakhiqizi bangaphandle.
Izindlela ezimbalwa zokusebenzisa izinto ze-semiconductor
I-Stepper iyisistimu yokuchayeka imaski. Ngokusebenzisa umthombo we-laser ukuqopha ifilimu yokuvikela ebusweni be-wafer, isekethe izokwakhiwa ngomsebenzi wokugcina idatha. Iningi lama-steppers lisebenzisa i-laser ye-excimer engakhiqiza umsebe we-laser we-UV ojulile. Umkhiqizi we-laser ye-excimer ohamba phambili noyinhloko i-Cymer wathengwa yi-ASML. Futhi i-stepper entsha izoba yi-EUV stepper engenza inqubo ibe ngaphansi kwe-10nm. Kodwa le ndlela manje isabuswa yizinkampani zakwamanye amazwe.
Kodwa kulindeleke ukuthi iShayina izokwenza intuthuko kancane kancane ekwenzeni ama-chip futhi kamuva ikwazi ukuzikhiqizela yona kanye nokukhiqizwa ngobuningi. Ama-stepper asekhaya nawo abonakala kusengaphambili futhi ngaleso sikhathi, isidingo somthombo we-laser onembile kakhulu sizokhula.
Okunye ukusetshenziswa okubanzi kwezinto ze-semiconductor yimboni yamaseli e-PV okuyimakethe yamandla ahlanzekile ekhula ngokushesha kakhulu enekhono elihle kakhulu emhlabeni. Amaseli elanga angahlukaniswa abe yi-crystalline silicon solar cell, ibhethri le-thin-film kanye nebhethri elihlanganisiwe le-III-V. Phakathi kwalokhu, iseli le-crystalline silicon solar linesicelo esibanzi kakhulu. Ngokuphambene nomthombo we-laser, iseli le-PV liyidivayisi edlulisela ukukhanya kugesi. Izinga lokuguqula i-photoelectric liyindinganiso yokubona ukuthi iseli le-PV lihle kangakanani. Indlela yokwenza izinto kanye nenqubo kule ndawo ibaluleke kakhulu.
Ngokuphathelene nokusika i-silicon wafer, kwasetshenziswa ithuluzi lokusika lendabuko, kodwa ngokunemba okuphansi kanye nokusebenza kahle okuphansi kanye nesivuno esincane. Ngakho-ke, amazwe amaningi aseYurophu, iNingizimu Korea, i-United States asevele ethule inqubo ye-laser enembile kakhulu kudala. Ezweni lethu, amandla ethu okukhiqiza amaseli e-PV afinyelele engxenyeni yomhlaba. Futhi eminyakeni emi-4 edlule, njengoba imboni ye-PV iqhubeka nokukhula, inqubo yokucubungula i-laser iye yasetshenziswa kancane kancane. Namuhla, inqubo ye-laser inegalelo embonini ye-PV ngokwenza ukusika i-wafer, ukubhala i-wafer, nokufaka ibhethri le-PERC.
Ukusetshenziswa kwesithathu kwe-semiconductor yi-PCB, kufaka phakathi i-FPCB. I-PCB, okuyingxenye ebalulekile kanye nesisekelo sayo yonke i-elekthronikhi, isebenzisa inani elikhulu lezinto ze-semiconductor. Eminyakeni embalwa edlule, njengoba ukunemba nokuhlanganiswa kwe-PCB kuba phezulu kakhulu, kuzovela i-PCB encane nencane kakhulu. Ngaleso sikhathi, idivayisi yokucubungula nokucubungula yokuxhumana yendabuko kuzoba nzima ukuyivumelanisa, kodwa inqubo ye-laser izosetshenziswa kakhulu.
Ukumaka nge-laser kuyindlela elula kakhulu kwi-PCB. Okwamanje, abantu bavame ukusebenzisa i-UV laser ukwenza ukumaka ebusweni bezinto zokwakha. Nokho, ukubhoboza nge-laser kuyindlela evame kakhulu kwi-PCB. Ukubhoboza nge-laser kungafinyelela ezingeni le-micrometer futhi kungenza imbobo encane kakhulu ummese womshini ongakwazi ukuyenza. Ngaphezu kwalokho, ukusika izinto zethusi kanye nokushisela okuhlanganisiwe okuqinile kwi-PCB nakho kungasebenzisa indlela ye-laser.
Njengoba i-laser ingena enkathini yokwenziwa kwemishini emincane, i-S&A Teyu ikhuthaze umshini wokupholisa amanzi opholile emoyeni onembile kakhulu
Uma sibheka emuva ekuthuthukisweni kwe-laser eminyakeni embalwa edlule, i-laser inezinhlelo eziningi zokusika insimbi kanye nokushisela. Kodwa ngokusebenza nge-micro-machining ngokunemba okuphezulu, isimo siphambene. Esinye sezizathu ukuthi ukucubungula insimbi kuwuhlobo lomshini onzima. Kodwa ukusebenza nge-micro-machining ngokunemba okuphezulu kudinga izinga eliphezulu lokwenza ngokwezifiso futhi kubhekene nezinselele ezifana nobunzima bokuthuthukisa le ndlela kanye nesikhathi esiningi esichithwayo. Kulezi zinsuku, ukusebenza nge-micro-machining ngokunemba okuphezulu kwe-laser kuhileleke kakhulu kuma-electronics abathengi njengefoni ehlakaniphile lapho isikrini sayo se-OLED sivame ukunqunywa yi-micro-machining ye-laser.
Eminyakeni eyi-10 ezayo, izinto ze-semiconductor zizoba yimboni eza kuqala. Ukucutshungulwa kwezinto ze-semiconductor cishe kungaba yisisusa sokuthuthuka okusheshayo kwe-laser micro-machining. I-laser micro-machining isetshenziswa kakhulu i-laser e-pulsed emfushane noma e-ultra-short pulsed, eyaziwa nangokuthi i-ultrafast laser. Ngakho-ke, ngokuthambekela kokusetshenziswa kwezinto ze-semiconductor, isidingo sokucutshungulwa kwe-laser okunembile kakhulu sizokhula.
Kodwa-ke, idivayisi ye-laser eshesha kakhulu nenembile iyadingeka kakhulu futhi idinga ukuhlonyiswa ngedivayisi yokulawula izinga lokushisa enembile ngokulinganayo.
Ukuze kuhlangatshezwane nokulindela kwemakethe kwedivayisi ye-laser enembile kakhulu yasekhaya, i-S&A Teyu ikhuthaze i-CWUP series recirculating laser water chiller enokuqina kokushisa okufinyelela ku-±0.1℃ futhi yenzelwe ngqo ukupholisa ama-laser e-ultrafast njenge-femtosecond laser, i-nanosecond laser, i-picosecond laser, njll. Thola ulwazi olwengeziwe mayelana neyunithi ye-CWUP series laser water chiller ku -https://www.teyuchiller.com/portable-water-chiller-cwup-20-for-ultrafast-laser-and-uv-laser_ul5
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