Iziphene ze-Soldering ze-SMT eziqhelekileyo kunye nezisombululo kwi-Electronics Manufacturing

ITekhnoloji ye-Surface Mount (SMT) ithandwa kakhulu kumzi-mveliso wezobuchwephesha ngenxa yokusebenza kwayo okuphezulu kunye neenzuzo zokuhlangana ezixinana kakhulu. Nangona kunjalo, iziphene ze-soldering kwinkqubo ye-SMT zizinto ezibalulekileyo ezichaphazela umgangatho kunye nokuthembeka kweemveliso ze-elektroniki. Eli nqaku liza kuphonononga iziphene eziqhelekileyo ze-soldering kwi-SMT kunye nezisombululo zabo.

Ukusoda okubandayo: I-cold soldering iyenzeka xa ubushushu be-soldering bungonelanga okanye ixesha le-solder lifutshane kakhulu, okubangela ukuba i-solder inganyibiliki ngokupheleleyo kwaye ibangele i-solder embi. Ukuze ugweme i-soldering ebandayo, abavelisi kufuneka baqinisekise ukuba umatshini we-reflow soldering unolawulo oluchanekileyo lweqondo lokushisa kwaye usete amaqondo okushisa afanelekileyo kunye namaxesha asekelwe kwiimfuno ezithile ze-solder paste kunye namacandelo.

Solder Bridging: I-solder bridging ngomnye umcimbi oqhelekileyo kwi-SMT, apho i-solder idibanisa iindawo zokuthengisa ezikufutshane. Oku kudla ngokubangelwa sisicelo sokuncamathisela solder ngokugqithisileyo okanye uyilo lwephedi yePCB engafanelekanga. Ukujongana ne-solder bridging, lungiselela inkqubo yokukhetha kunye nendawo, lawula inani le-solder paste esetyenzisiweyo, kwaye uphucule uyilo lwe-PCB pad ukuqinisekisa isithuba esaneleyo phakathi kweepads.

I-Voids: I-Voids ibhekisela kubukho beendawo ezingenanto ngaphakathi kweendawo zokubethelela ezingazaliswanga nge-solder. Oku kunokuchaphazela kakhulu amandla kunye nokuthembeka kwe-soldering. Ukuthintela i-voids, cwangcisa ngokufanelekileyo iprofayili ye-reflow soldering yeqondo lokushisa ukuqinisekisa ukuba i-solder iyanyibilika ngokupheleleyo kwaye igcwalise iipads. Ukongeza, qinisekisa ukuba kukho umphunga owaneleyo we-flux ngexesha lenkqubo ye-soldering ukunqanda intsalela yegesi enokwenza i-voids.

iShift yecandelo: Ngethuba lenkqubo ye-reflow soldering, amacandelo angahamba ngenxa yokunyibilika kwe-solder, ekhokelela kwizikhundla ezingalunganga. Ukuthintela ukutshintshwa kwecandelo, lungiselela inkqubo yokukhetha kunye nendawo kwaye uqinisekise ukuba iiparamitha zomatshini wokuchola kunye nendawo zisetwe ngokuchanekileyo, kubandakanya isantya sokubeka, uxinzelelo, kunye nohlobo lombhobho. Khetha imilomo efanelekileyo ngokusekwe kubungakanani kunye nokumila kwezixhobo ukuqinisekisa ukuba zincanyathiselwe ngokukhuselekileyo kwiPCB. Ukuphucula uyilo lwephedi ye-PCB ukuqinisekisa indawo eyaneleyo yephedi kunye nesithuba kunokunciphisa ngokufanelekileyo utshintsho lwecandelo.

Imekobume yobushushu obuzinzileyo: Indawo yobushushu obuzinzileyo ibalulekile kumgangatho wokusoda. IiChillers zamanzi , ngokulawula ngokuchanekileyo ubushushu bamanzi okupholisa, ukubonelela ngokuzinza okupholileyo okuphantsi kweqondo lokushisa kumatshini wokuphinda uthengise i-solderflowing kunye nezinye izixhobo. Oku kunceda ukugcina i-solder ngaphakathi kwinqanaba lobushushu elifanelekileyo lokunyibilika, ukuphepha iziphene ze-solder ezibangelwa ukushisa okanye ukufudumala.

Ngokulungiselela inkqubo yokukhetha kunye nendawo, ukuseta ngokufanelekileyo iprofayile yobushushu bokuthengisa, ukuphucula uyilo lwePCB, kunye nokukhetha imilomo efanelekileyo, sinokuziphepha ngokufanelekileyo iziphene eziqhelekileyo zokuthengisa kwi-SMT kunye nokuphucula umgangatho kunye nokuthembeka kweemveliso.