Kutheni ulawulo lobushushu lubalulekile kwiSemiconductor Manufacturing?

Kwimveliso ye-semiconductor, ulawulo oluchanekileyo lobushushu ludlala indima ebalulekileyo ekuqinisekiseni umgangatho we-chip, ukusebenza, kunye nemveliso yemveliso. Nokuba ukuguquguquka okuncinci kobushushu kunokubangela utshintsho olukhulu kwindlela yokuziphatha kunye neziphumo zenkqubo, okunokukhokelela kwiziphene okanye ukusilela kwesixhobo.

Impembelelo yoxinzelelo lwe-Thermal

Izixhobo ze-Semiconductor ziquka iileyile ezininzi zezixhobo kunye ne-coefficients eyahlukeneyo yokwandiswa kwe-thermal (CTE). Umzekelo, ii-silicone wafers, i-metal interconnects, kunye ne-dielectric layers zanda okanye zikhontraktha ngemilinganiselo eyahlukeneyo ngexesha lokufudumeza okanye ukupholisa ngokukhawuleza. Oku kungafaniyo kunokudala uxinzelelo lobushushu, okukhokelela kwimiba enzulu yokuvelisa efana nale:

* Iintanda: Umphezulu okanye iintanda zangaphakathi kwii-wafers zinokubeka esichengeni ukuthembeka koomatshini kwaye kukhokelela kukusilela kwesixhobo.

* I-Delamination: Iifilim ezibhityileyo, ezinje ngentsimbi okanye i-dielectric layers, zinokwahlula, zenze buthathaka ukusebenza kombane wetshiphu kunye nokuthembeka kwexesha elide.

* Utshintsho lwesakhiwo: Izakhiwo zesixhobo zinokujija ngenxa yoxinzelelo, zibangele iingxaki zombane njengokuvuza okanye iisekethe ezimfutshane.

Indima yoLawulo loBubushushu obuchanekileyo

Iinkqubo zokulawula ubushushu obuphezulu njenge-TEYU i-industrial chillers ziyilelwe ukugcina uzinzo lobushushu ngokuchaneka okukhethekileyo. Umzekelo, i-TEYU's ultrafast laser chiller inikezela ngokuchaneka kokulawula ukuya kuthi ga kwi-±0.08 °C, iqinisekisa uzinzo lwenkqubo yezixhobo ezibalulekileyo ze-semiconductor, kubandakanywa i-etchers, iinkqubo zokubeka, kunye nezifakeli ze-ion.

IiNzuzo zokuPholisa ngokuchanekileyo kwiiNkqubo zeSemiconductor

1. Ukuthintela ukuKhanya koxinzelelo lwe-Thermal: Ngokugcina ukupholisa okufanayo, ii-chillers zinciphisa imiphumo ye-CTE yokungahambi kakuhle phakathi kwezinto ezahlukeneyo, ukunciphisa ngokufanelekileyo umngcipheko wokuqhekeka kunye ne-delamination ngexesha lokuhamba ngebhayisikili ye-thermal.

2. Ukuphucula i-Doping Uniformity: Kwi-ion implantation kunye nokufakwa okulandelayo, iimeko ezizinzileyo ze-thermal ziqinisekisa ukusebenza kwe-dopant engaguqukiyo kwi-wafer, ukuphucula ukusebenza kwe-chip kunye nokuthembeka.

3. Ukuphucula ukuNxibelelana koMaleko we-Oxide: Ukulawulwa kweqondo lokushisa ngokuchanekileyo kunceda ukuphelisa i-edge-to-center gradients ye-thermal ngexesha le-oxidation, iqinisekisa ubuninzi besango le-oxide yesango, kubalulekile kwiimpawu ze-transistor ezingaguqukiyo.

Ukuqukumbela

Ulawulo lobushushu luyimfuneko kwimveliso ye-semiconductor. Ngolawulo oluchanekileyo oluchanekileyo lwe-thermal, abavelisi banokunciphisa iziphene ezibangelwa uxinzelelo lwe-thermal, ukuphucula ukufana kwe-doping kunye neenkqubo ze-oxidation, kwaye ekugqibeleni bafezekise izivuno eziphezulu ze-chip kunye nokusebenza okungcono kwesixhobo.