Izindaba Zemboni
Ukulawulwa Kwezinga lokushisa Okunembile Kwezinhlelo Ze-Laser Nezicelo Zezimboni Kusukela ngo-2002
Ulimi
Emkhiqizweni we-elekthronikhi, i-SMT isetshenziswa kakhulu kodwa ijwayele ukonakala njenge-soldering ebandayo, ibhuloho, i-voids, kanye noshintsho lwengxenye. Lezi zinkinga zingancishiswa ngokulungiselela izinhlelo zokukhetha nendawo, ukulawula amazinga okushisa e-solder, ukuphatha izinhlelo zokusebenza zokunamathisela i-solder, ukuthuthukisa idizayini yephedi ye-PCB, nokugcina izinga lokushisa elizinzile. Lezi zinyathelo zithuthukisa ikhwalithi nokuthembeka komkhiqizo.
I-Surface Mount Technology (SMT) idume kakhulu embonini yokukhiqiza izinto zikagesi ngenxa yokusebenza kahle kwayo kanye nezinzuzo zokuhlangana eziphakeme kakhulu. Kodwa-ke, amaphutha e-soldering ohlelweni lwe-SMT yizici ezibalulekile ezithinta ikhwalithi nokuthembeka kwemikhiqizo ye-elekthronikhi. Lesi sihloko sizohlola amaphutha ajwayelekile e-solder ku-SMT nezisombululo zawo.
I-Cold Soldering: I-Cold Soldering kwenzeka lapho izinga lokushisa le-solder linganele noma isikhathi se-solder sifushane kakhulu, okubangela ukuthi i-solder ingancibiliki ngokuphelele futhi kubangele ukudayiswa okungalungile. Ukuze ugweme i-soldering ebandayo, abakhiqizi kufanele baqinisekise ukuthi umshini wokugcwalisa umshini wokugcwalisa umshini unokulawula ukushisa okunembile futhi usethe izinga lokushisa elifanele le-solder nezikhathi ngokusekelwe ezidingweni ezithile ze-solder paste kanye nezingxenye.
I-Solder Bridging: Ibhuloho le-Solder kungenye inkinga evamile ku-SMT, lapho i-solder ixhuma amaphuzu asondelene. Lokhu kuvame ukubangelwa uhlelo lokusebenza lokunamathisela i-solder ngokweqile noma umklamo wephedi we-PCB ongenangqondo. Ukuze ubhekane nebhuloho le-solder, lungiselela uhlelo lokukhetha nendawo, lawula inani le-solder paste esetshenzisiwe, futhi uthuthukise idizayini yephedi ye-PCB ukuze uqinisekise isikhala esanele phakathi kwamaphedi.
I-Voids: I-Voids ibhekisela ekubeni khona kwezikhala ezingenalutho ngaphakathi kwamaphoyinti e-solder angagcwaliswa nge-solder. Lokhu kungaba nomthelela omubi emandleni nokuthembeka kwe-soldering. Ukuze uvimbele i-voids, setha kahle iphrofayili ye-reflow soldering lokushisa ukuze uqinisekise ukuthi i-solder iyancibilika ngokugcwele futhi igcwalisa amaphedi. Ukwengeza, qinisekisa ukuthi kukhona ukuhwamuka okwanele kwe-flux ngesikhathi senqubo yokuhlanganisa ukuze ugweme insalela yegesi engenza i-voids.
I-Component Shift: Ngesikhathi senqubo ye-reflow soldering, izingxenye zingase zihambe ngenxa yokuncibilika kwe-solder, okuholela ekumiseni okungalungile kwe-solder. Ukuze uvimbele ukushintsha kwengxenye, lungiselela uhlelo lokukhetha nendawo futhi uqinisekise ukuthi amapharamitha omshini wokukhetha nendawo asethwe ngendlela efanele, okuhlanganisa isivinini sokubeka, ukucindezela, nohlobo lombhobho. Khetha imibhobho efanelekile ngokusekelwe kusayizi nokuma kwezingxenye ukuze uqinisekise ukuthi zinamathiselwe ngokuphephile ku-PCB. Ukuthuthukisa idizayini yephedi ye-PCB ukuze kuqinisekiswe indawo eyanele yephedi nesikhala nakho kunganciphisa ngempumelelo ukushintsha kwengxenye.
Indawo Yezinga Lokushisa Ezinzile: Indawo yokushisa ezinzile ibalulekile kwikhwalithi yokudayiswa. Ama-Water Chillers , ngokulawula ngokunembile izinga lokushisa lamanzi okupholisa, ahlinzeka ngokupholisa okuzinzile kwezinga lokushisa eliphansi kwemishini yokuphinda ithengiselwe i-solderflow nezinye izinto zokusebenza. Lokhu kusiza ukugcina i-solder ingaphakathi kwebanga lokushisa elifanele lokuncibilika, ukugwema ukonakala kwe-solder okubangelwa ukushisa ngokweqile noma ukushisa ngaphansi.
Ngokulungiselela uhlelo lokukhetha nendawo, ukusetha kahle iphrofayili yethempelesha yokugcwala kabusha, ukuthuthukisa idizayini ye-PCB, nokukhetha imibhobho elungile, singagwema ngempumelelo izinkinga ezivamile zokudayiswa ku-SMT futhi sithuthukise ikhwalithi nokuthembeka kwemikhiqizo.
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