Ma wafer ndi zinthu zofunika kwambiri popanga ma semiconductor, omwe amagwiritsidwa ntchito ngati zinthu zomangira ma circuits ophatikizidwa ndi zida zina zamagetsi. Kawirikawiri amapangidwa kuchokera ku monocrystalline silicon, ma wafer ndi osalala, athyathyathya, ndipo nthawi zambiri amakhala ndi makulidwe a 0.5 mm, okhala ndi mainchesi 200 (mainchesi 8) kapena 300 mm (mainchesi 12). Njira yopangirayi ndi yovuta kwambiri, kuphatikizapo kuyeretsa silicon, kudula ingot, kupukuta wafer, photolithography, etching, ion implantation, electroplating, wafer testing, ndipo potsiriza, kudula wafer. Chifukwa cha zinthu zawo, ma wafer amafuna kuwongolera mwamphamvu kuyera, kusalala, ndi kuchuluka kwa zolakwika, chifukwa izi zimakhudza mwachindunji magwiridwe antchito a chip.
Mavuto Omwe Amafala Podula Ma Wafer
Ukadaulo wodulira pogwiritsa ntchito laser umagwiritsidwa ntchito kwambiri pokonza wafer chifukwa cha kulondola kwake kwakukulu komanso ubwino wake wosakhudzana ndi kukhudza. Komabe, mavuto angapo abwino angabuke panthawi yodulira pogwiritsa ntchito laser:
Ma Burrs ndi Chipping: Zolakwika izi nthawi zambiri zimachitika chifukwa cha kusakwanira kwa zida zoziziritsira kapena zodulira zakale. Kupititsa patsogolo makina oziziritsira mwa kukweza mphamvu ya chiller ndikuwonjezera kuyenda kwa madzi kungathandize kuchepetsa kutentha kosagwirizana ndikuchepetsa kuwonongeka kwa m'mphepete.
Kuchepa kwa Kulondola kwa Kudula: Chifukwa cha malo osakhazikika a makina, matebulo ogwirira ntchito osakhazikika, kapena magawo olakwika odulira. Kulondola kumatha kubwezeretsedwa mwa kukonza makina ndikuwongolera makonda a magawo.
Malo Odulidwa Osafanana: Kuwonongeka kwa tsamba, kusakhazikika bwino, kapena kusakhazikika bwino kwa spindle kungayambitse kusayenda bwino kwa pamwamba. Kukonza nthawi zonse ndi kukonzanso makina ndikofunikira kuti kudula kukhale kosalala.
Udindo wa Laser Chillers mu Wafer Dicing
Ma laser chiller amagwira ntchito yofunika kwambiri pakusunga magwiridwe antchito ndi kukhazikika kwa makina a laser ndi optical omwe amagwiritsidwa ntchito podula ma wafer. Mwa kupereka njira yowongolera kutentha molondola, amaletsa kusuntha kwa mafunde a laser komwe kumachitika chifukwa cha kusinthasintha kwa kutentha, komwe ndikofunikira kwambiri kuti kukhale kolondola pakudula. Kuziziritsa bwino kumachepetsanso kupsinjika kwa kutentha panthawi yodula, kuchepetsa chiopsezo cha kusokonekera kwa lattice, chip, kapena microcracks zomwe zingawononge ubwino wa wafer.
Kuphatikiza apo, ma laser chiller amagwiritsa ntchito njira yoziziritsira madzi yotsekedwa yomwe imalekanitsa dera loziziritsira ku kuipitsidwa kwakunja. Ndi njira zowunikira zophatikizika komanso zochenjeza, zimathandizira kwambiri kudalirika kwa nthawi yayitali kwa zida zodulira ma wafer.
Popeza ubwino wa wafer dicing umakhudza mwachindunji kuchuluka kwa chip, kugwiritsa ntchito laser chiller yodalirika kumathandiza kuchepetsa zolakwika zomwe zimachitika nthawi zambiri ndikusunga magwiridwe antchito nthawi zonse. Kusankha chiller yoyenera kutengera kutentha kwa makina a laser komanso malo ogwirira ntchito, komanso kukonza nthawi zonse, ndikofunikira kwambiri kuti zitsimikizire kuti ntchitoyo ikuyenda bwino komanso yokhazikika.
![Kukonza Ubwino wa Kudula Ma Wafer mu Laser Processing]()