Ziziphi iingxaki zeWafer Dicing eziqhelekileyo kwaye zinganceda njani iiLaser Chillers?

I-Wafers zizixhobo ezisisiseko kwimveliso ye-semiconductor, esebenza njengama-substrates kwiisekethe ezidibeneyo kunye nezinye izixhobo ze-microelectronic. Ngokuqhelekileyo zenziwe nge-silicon ye-monocrystalline, ii-wafers zigudile, zisicaba, kwaye zihlala zi-0.5 mm ubukhulu, kunye nobubanzi obuqhelekileyo be-200 mm (8 intshi) okanye i-300 mm (i-intshi eziyi-12). Inkqubo yemveliso intsonkothile kakhulu, ibandakanya ukucocwa kwesilicon, ukunqunyulwa kwe-ingot, ukupholiswa kwewafer, ifotolithography, i-etching, implantation ye-ion, i-electroplating, uvavanyo lwe-wafer, kwaye ekugqibeleni, i-wafer dicing. Ngenxa yeepropathi zazo zemathiriyeli, ii-wafers zifuna ulawulo olungqongqo phezu kobunyulu, ukuthamba, kunye nemilinganiselo yesiphene, njengoko ezi zichaphazela ngokuthe ngqo ukusebenza kwetshiphu.

Imingeni yeWafer Dicing eqhelekileyo

Itekhnoloji ye-laser dicing yamkelwa ngokubanzi ekusetyenzweni kwe-wafer ngenxa yokuchaneka kwayo okuphezulu kunye neenzuzo ezingadibanisiyo. Nangona kunjalo, imiba emininzi yomgangatho inokuvela ngexesha lokudayela:

IiBurrs kunye neChipping: Ezi ziphene zihlala zibangelwa kukupholisa okunganelanga okanye izixhobo zokusika ezigugileyo. Ukuphucula inkqubo yokupholisa ngokuphucula umthamo we-chiller kunye nokwandisa ukuhamba kwamanzi kunokuncedisa ukunciphisa ukufudumala okungalinganiyo kunye nokunciphisa umonakalo owenziweyo.

Ukunciphisa Ukuchaneka kokuNcitshiswa: Kubangelwa ukungasebenzi kakuhle komatshini, iitafile zokusebenza ezingazinzanga, okanye iiparitha zokusika ezingalunganga. Ukuchaneka kunokubuyiselwa ngokuphucula ukulinganisa umatshini kunye nokuphucula izicwangciso zeparameter.

I-Uneven Cut Surfaces: Ukunxitywa kwe-blade, iisetingi ezingafanelekanga, okanye ukungahambi kakuhle kwe-spindle kunokukhokelela kwizitenxo zomphezulu. Ukugcinwa rhoqo kunye nokulungiswa komatshini kubalulekile ukuqinisekisa ukusika okugudileyo.

Indima yeLaser Chillers kwiWafer Dicing

Laser chillers  idlala indima ebalulekileyo ekugcineni ukusebenza kunye nokuzinza kwelaser kunye neenkqubo zokukhanya ezisetyenziswa kwi-wafer dicing. Ngokuzisa ulawulo oluchanekileyo lobushushu, banqanda i-laser wavelength drift okubangelwa kukuguquguquka kobushushu, okubalulekileyo ekugcineni ukuchaneka kokusika. Ukupholisa okusebenzayo kukwanciphisa uxinzelelo lobushushu ngexesha lokudayela, ukunciphisa umngcipheko wokugqwethwa kwe-lattice, ukuchopha, okanye ii-microcracks ezinokubeka esichengeni umgangatho we-wafer.

Ukongeza, i-laser chillers isebenzisa inkqubo yokupholisa amanzi evaliweyo ekwahlula isekethe yokupholisa kungcoliseko lwangaphandle. Ngeenkqubo ezidibeneyo zokubeka iliso kunye ne-alamu, ziphucula kakhulu ukuthembeka kwexesha elide kwezixhobo zokudayiza i-wafer.

Njengoko umgangatho we-wafer dicing uchaphazela ngokuthe ngqo isivuno se-chip, ukubandakanya i-laser chiller ethembekileyo kunceda ukunciphisa iziphene eziqhelekileyo kunye nokugcina ukusebenza okungaguqukiyo. Ukukhetha i-chiller efanelekileyo ngokusekelwe kumthwalo we-thermal we-laser kunye nokusingqongileyo okusebenzayo, kunye nokugcinwa rhoqo, ngundoqo ekuqinisekiseni ukusebenza okuzinzileyo nokusebenzayo.