Ziziphi iingxaki eziqhelekileyo zokusikwa kweWafer kwaye zinganceda njani iiLaser Chillers?

Iiwafers zizinto ezisisiseko kwimveliso ye-semiconductor, zisebenza njengezinto ezisetyenziswa kwiisekethe ezidibeneyo kunye nezinye izixhobo ze-microelectronic. Ngokwesiqhelo zenziwe nge-silicon e-monocrystalline, iiwafers zigudile, zithe tyaba, kwaye zihlala zinobukhulu obuyi-0.5 mm, zine-diameters eziqhelekileyo ze-200 mm (8 intshi) okanye i-300 mm (12 intshi). Inkqubo yemveliso iyinkimbinkimbi kakhulu, ibandakanya ukucocwa kwe-silicon, ukunqunyulwa kwe-ingot, ukupolishwa kwe-wafer, i-photolithography, ukugrumba, ukufakwa kwe-ion, i-electroplating, uvavanyo lwe-wafer, kwaye ekugqibeleni, ukunqunyulwa kwe-wafer. Ngenxa yeempawu zazo zezinto, iiwafers zifuna ulawulo oluqinileyo malunga nobumsulwa, ukuthamba, kunye namazinga eziphene, njengoko ezi zinto zichaphazela ngqo ukusebenza kwe-chip.

Imingeni eqhelekileyo yokuDayisha iiWafer

Itekhnoloji yokusika nge-laser iyasetyenziswa kakhulu ekucutshungulweni kwe-wafer ngenxa yokuchaneka kwayo okuphezulu kunye neenzuzo zokungachukumisi. Nangona kunjalo, iingxaki ezininzi zomgangatho zinokuvela ngexesha lokusika:

IiBurrs kunye neChipping: Ezi ziphene zihlala zibangelwa kukungapholi ngokwaneleyo okanye izixhobo zokusika ezigugileyo. Ukuphucula inkqubo yokupholisa ngokuphucula amandla okupholisa kunye nokwandisa ukuhamba kwamanzi kunokunceda ukunciphisa ubushushu obungalinganiyo kunye nokunciphisa umonakalo obangelwa ngumphetho.

Ukuchaneka Kokusika Okunciphileyo: Kubangelwa kukubekwa kakubi komatshini, iitafile zokusebenza ezingazinzanga, okanye iiparameter zokusika ezingachanekanga. Ukuchaneka kunokubuyiselwa ngokuphucula ukulinganiswa komatshini kunye nokwenza ngcono useto lweeparameter.

Imiphezulu Engalinganiyo: Ukonakala kweblade, ukuseta okungafanelekanga, okanye ukungahambi kakuhle kwe-spindle kunokubangela ukungalungelelani komphezulu. Ukugcinwa rhoqo kunye nokulungiswa kwakhona komatshini kubalulekile ukuqinisekisa ukusika okugudileyo.

Indima yeeLaser Chillers kwiWafer Dicing

Ii-laser chillers zidlala indima ebalulekileyo ekugcineni ukusebenza kunye nozinzo lweenkqubo ze-laser kunye ne-optical ezisetyenziswa kwi-wafer dicing. Ngokunikezela ngolawulo oluchanekileyo lobushushu, zithintela ukushukuma kwe-laser wavelength okubangelwa kukuguquguquka kobushushu, okubaluleke kakhulu ekugcineni ukuchaneka kokusika. Ukupholisa okusebenzayo kunciphisa uxinzelelo lobushushu ngexesha lokudibanisa, kunciphisa umngcipheko wokuphambuka kwe-lattice, i-chipping, okanye ii-microcracks ezinokonakalisa umgangatho we-wafer.

Ukongeza, ii-laser chillers zisebenzisa inkqubo yokupholisa amanzi evaliweyo eyahlula isekethe yokupholisa ekungcoleni kwangaphandle. Ngeenkqubo ezidibeneyo zokubeka esweni kunye nezokulumkisa, ziphucula kakhulu ukuthembeka kwexesha elide kwezixhobo zokudaya ii-wafer.

Njengoko umgangatho we-wafer dicing uchaphazela ngokuthe ngqo i-chip yield, ukufaka i-laser chiller ethembekileyo kunceda ukunciphisa iziphene eziqhelekileyo kunye nokugcina ukusebenza okuzinzileyo. Ukukhetha i-chiller efanelekileyo ngokusekelwe kumthwalo wobushushu benkqubo ye-laser kunye nendawo yokusebenza, kunye nokugcinwa rhoqo, kubalulekile ukuqinisekisa ukusebenza okuzinzileyo nokusebenzayo.