Ungakwazi yini ukusho umehluko ku-laser ye-nanosecond, i-picosecond laser ne-femtosecond laser?

Okokuqala, ake sithole ukuthi lezi “zesibili” zisho ukuthini.

1 nanosecond = 10 ^-9 okwesibili

1 isekhondi = 10 ^-12 okwesibili

1 femtosecond = 10 ^-15 okwesibili

Ngakho-ke, umehluko omkhulu phakathi kwe-nanosecond laser, i-picosecond laser ne-femtosecond laser usesikhathini sazo sesikhathi.

Incazelo ye-laser utlrafast

Kudala, abantu bazama ukusebenzisa i-laser ukwenza i-micromachining. Kodwa-ke, njengoba i-laser yendabuko inobubanzi be-pulse ende kanye nomfutho we-laser ophansi, izinto ezizocutshungulwa kulula ukuncibilika futhi ziqhubeke zihwamuka. Yize i-laser beam ingagxilwa endaweni encane kakhulu ye-laser, umthelela wokushisa ezintweni usemkhulu impela, okhawulela ukunemba kokucubungula. Ukunciphisa kuphela umphumela wokushisa kungathuthukisa ikhwalithi yokucubungula.

Kepha lapho i-laser ye-ultrafast isebenza ezintweni zokwakha, umphumela wokucubungula unoshintsho olukhulu. Njengoba amandla okushaya kwenhliziyo enyuka kakhulu, ukuminyana kwamandla aphezulu kunamandla ngokwanele ukucisha izinto zikagesi zangaphandle. Njengoba ukusebenzisana phakathi kwe-laser esheshayo nezinto ezisetshenziswayo kukufushane kakhulu, i-ion isivele ichithiwe endaweni ebonakalayo ngaphambi kokuba idlulisele amandla ezintweni ezizungezile, ngakho-ke akukho mphumela wokushisa ozolethwa ezintweni ezizungezile. Ngakho-ke, i-ultrafast laser processing yaziwa nangokuthi ukucubungula okubandayo.

Kunezinhlobonhlobo zezicelo ze-laser esheshayo ekukhiqizeni izimboni. Ngezansi sizobala ezimbalwa:

1.Ukubhoboza imigodi

Emklamo webhodi lesifunda, abantu baqala ukusebenzisa isisekelo se-ceramics ukuze bathathe indawo yesisekelo sepulasitiki sendabuko ukuze babone ukushisa okungcono kakhulu. Ukuze uxhume izingxenye ze-elekthronikhi, izinkulungwane ze μm level izimbobo ezincane zidinga ukubhobozwa ebhodini. Ngakho-ke, ukugcina isisekelo sizinzile ngaphandle kokuphazanyiswa okokufaka ukushisa ngesikhathi sokubhoboza imbobo sekubaluleke kakhulu. Futhi picosecond lase iyithuluzi ekahle.

I-laser ye-Picosecond ibona ukubhobozwa kwembobo ngokubhoboza okuyisicefe futhi igcina ukufana kwembobo. Ngaphezu kwebhodi lesifunda, i-picosecond laser iyasebenza futhi ekwenzeni imbobo yekhwalithi ephezulu kufilimu encane yepulasitiki, i-semiconductor, ifilimu yensimbi nesafire.

2.Ukubhala nokusika

Umugqa ungakhiwa ngokuskena okuqhubekayo ukuze umboze ukushaya kwe-laser. Lokhu kudinga inani elikhulu lokuskena ukuze ungene ujule phakathi kwezitsha zobumba kuze kube yilapho umugqa usufinyelele ku-1/6 wogqinsi lwempahla. Bese uhlukanisa imojuli ngayinye kusisekelo se-ceramics kanye nale migqa. Lolu hlobo lokuhlukanisa lubizwa nge-scribing.

Enye indlela yokuhlukanisa i-pulse laser ablation cutting. Kudinga ukucwiliswa kwempahla kuze kube yilapho isisikwe ngokuphelele.

Ngokubhala nokusika okungenhla, i-picosecond laser kanye ne-nanosecond laser yizinketho ezifanele.

3.Ukususwa kwe-coating

Okunye ukusetshenziswa kwe-micromachining ye-ultrafast laser ukususwa kwe-coating. Lokhu kusho ukususa ngokunembile i-coating ngaphandle kokulimaza noma ukulimaza kancane izinto eziyisisekelo. I-ablation ingaba imigqa yama-micrometer ambalwa ububanzi noma isikali esikhulu samasentimitha-skwele amaningana. Njengoba ububanzi bokugqoka buncane kakhulu kunobubanzi be-ablation, ukushisa ngeke kudlulisele ohlangothini. Lokhu kwenza i-nanosecond laser ifaneleke kakhulu.

I-Ultrafast laser inamandla amakhulu nekusasa elithembisayo. Ayifaki ukucubungula okudingekile, ukuhlanganisa kalula, ukusebenza kahle kokucubungula okuphezulu, ukusetshenziswa okuphansi kwezinto ezibonakalayo, ukungcoliswa kwemvelo okuphansi. Isetshenziswe kabanzi kwezezimoto, ze-elekthronikhi, izinto zikagesi, ukwenziwa kwemishini, njll.. Ukuze ugcine i-laser esheshayo isebenza ngokunembile esikhathini eside, izinga lokushisa layo kufanele ligcinwe kahle. S&Uchungechunge lwe-Teyu CWUP ama-chillers amanzi aphathwayo zilungele kakhulu ukupholisa ama-laser asheshayo afika ku-30W. Lawa mayunithi e-laser chiller anezinga eliphezulu kakhulu lokunemba kwe ±0.1℃ futhi isekele umsebenzi wokuxhumana we-Modbus 485. Ngepayipi eliklanywe kahle, ithuba lokukhiqiza ibhamuza selincane kakhulu, okwehlisa umthelela ku-laser esheshayo